Canon Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Konica Minolta, Inc.

Tokyo Electron Limited

Toshiba Memory Corporation

Keio University

Tdk Corporation

Honda Motor Co., Ltd.

Jfe Steel Corporation

Hamamatsu University School of Medicine

Niigata Co., Ltd.

Yohei Sato

Torachika Osada

Yasuo Kotaki

Hiroshi Tomita

Toshihiko Ujita

Keiichiro Tsukuda

Hisashi Okuchi

Masanori Takenouchi

Kenjiro Watanabe

Hidemi Kubota

Hidekazu Hayashi

Kazuhiro Nakajima

Kazuaki Masuda

Masahiko Higuma

Yoichi Taneya

Takashi Saito

Jun Kawai

Koji Yamakawa

Hiroyuki Ishinaga

Akihisa Shimomura

Hiroshi Sugitani

Takayuki Toshima

Takehiko Orii

Hiroki Ohno

Tokuya Ohta

Kazuyuki Mitsuoka

Gen You

Sadayuki Sugama

Mitsuaki Iwashita

Takayoshi Tsutsumi

Linan Ji

Hiroaki Kozai

Yasuhito Yoshimizu

Satoshi Wakatsuki

Yukiko Kitajima

Yusuke Hayashi

Tadayoshi Inamoto

Isao Imamura

Akihiko Shimomura

Masako Shimomura

Yoshinori Yoshida

Keiichi Sawa

Kazunari Ishizuka

Kayomi Sato

Ryoichiro Kurobe

Mitsuyoshi Makida

Wataru Takahashi

Shuichi Murakami

Ryoji Inoue

Akio Saito

Masahiro Yoshida

Atsuko Sakata

Masayuki Kitamura

Osamu Shindo

Junichi Wada

Takayuki Ono

Hiroshi Koizumi

Yoshitsugu Suzuki

Takeshi Ishizaki

Masayasu Shigematsu

Masaaki Izumida

Toshiyuki Sasaki

Kazuo Iwata

Akira Matsuzaki

Shin Ishimatsu

Daisuke Ikeno

Satoru Ando

Yasuo Kato

Yoichi Tobiyama

Makoto Yamashita

Satoshi Shimazu

Masaki Inaba

Shigeki Fukui

Masaru Iketani

Masaaki Kaneko

Masayuki Ueno

Shinichi Kawaguchi

Ken Hosaka

Toshinobu Miyagoshi

Takahiro Yamamoto

Hisashi Fukai

Tomotaka Ariga

Momoe Katsumata

Eisuke Horii

Yutaka Kojima

Hikaru Hamano

Akihiko Furuta

Yoshihiko Yoshihara

Kazuhito Furumoto

Akihisa Yamada

Tadashi Hirano

Hideyuki Eguchi

Seijiro Sunaga

Toshihiko Ooi

Ryohei Kitao

Hiroyuki Iwasaki

Toshiyuki Okuma

Tatsuaki Sato

Yosuke Nakano

Taiji Yoshinari

A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.

Substrate processing apparatus

A stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.

Stamp tool, transfer device, and element array manufacturing method

An inkjet head includes a first and a second channel substrates. At least one of the first and the second channel substrates is formed of silicon. A bonding interface of the first and the second channel substrates is bonded via an adhesive layer. A protective film containing a compound having a Si—C bond is formed on: an ink channel surface formed of silicon among the first and the second channel substrates; and a surface of the channel substrate side formed of silicon in the adhesive layer.

Inkjet head, and method for producing inkjet head

A vehicle brake system includes a first fluid pressure generating device for generating a fluid pressure according to a brake operating amount, a second fluid pressure generating device for generating a fluid pressure by moving a piston with an electric actuator, and a switching valve switchable between a first state allowing communication between the first fluid pressure generating device and a vehicle behavior stabilizing device and a second state allowing communication between the second fluid pressure generating device and the vehicle behavior stabilizing device. A control device places the switching valve in the second state during execution of automatic brake control, and places the switching valve in the first state when a predetermined abnormality occurs in the vehicle, except that the control device places the switching valve in the second state when an abnormality including inability of the second fluid pressure generating device to generate the fluid pressure occurs.

Vehicle brake system

An inkjet head contains a silicon nozzle substrate having an ink channel surface and an ink ejection surface facing the channel surface, and having a nozzle penetrating from the channel surface to the ejection surface; a channel substrate bonded to the channel surface of the silicon nozzle substrate, and including an ink channel and a substrate body that forms the ink channel; and a liquid-repellent film provided on the ejection surface of the silicon nozzle substrate. The channel substrate includes a through channel that penetrates the substrate body so as to face the nozzle, n-number of individual circulation channels that communicate with the through channel, extend in a direction away from the nozzle, and have a portion overlapping the substrate body in a plan view. A positional relationship between each of the individual circulation channels and the nozzle satisfies a specific Expression 1.

Inkjet head, production method for inkjet head, and inkjet-recording device

Provided is an inkjet head containing a nozzle plate having at least a substrate, wherein the nozzle plate has a liquid-repellent layer on an outermost surface of the substrate on an ink ejection surface side; a liquid-repellent layer base film is provided between the substrate and the liquid-repellent layer; and the liquid-repellent layer base film contains at least silicon (Si) and carbon (C), and having a maximum peak P of a binding energy of a Si2p orbital of a surface portion measured by X-ray photoelectron spectroscopy is in the range represented by the following Formula (1), Formula (1): 99.6 (eV)≤P≤101.9 (eV).

Inkjet head, method of manufacturing inkjet head, and inkjet recording method

There are provided an inkjet head, an inkjet image forming apparatus, a nozzle plate manufacturing method, and an inkjet head manufacturing method capable of improving durability against wiping on an ink discharge surface. The inkjet head includes a nozzle substrate including nozzle holes from which ink is discharged. The nozzle substrate has an irregularity structure formed on an ink discharge surface such that neither ink particles contained in the ink nor a wiping member that wipes the ink discharge surface get caught by the irregularity structure.

Inkjet head, inkjet image forming apparatus, nozzle plate manufacturing method, and inkjet head manufacturing method

The immediacy is not reduced, and autofocus is not started while the focus position being selected. The image pickup apparatus includes an operation member that selects a position for performing autofocus using a light input device that detects the movement of the finger and instructs the start of autofocus by an operation by the finger. When autofocus being performed, a display object for selecting a position for performing autofocus is displayed on the display unitand the viewfinder in-field display unit. The system control unitmoves the display object according to the movement amount of the finger detected by the light input device, and starts autofocus at the position of the display object when the operation member is operated. The light input device is disposed below the face, of the operation member, on which the finger is placed.

Image pickup apparatus and electronic device having optical input device

Disclosed is a method of manufacturing, a metal nozzle plate, in which is formed a nozzle for discharging a liquid and that is to be bonded with adhesive to a head chip provided with an actuator for discharging the liquid, the method including: forming the nozzle in a metal plate-like member; forming a groove in the metal plate-like member; and performing exterior processing with respect to the nozzle plate.

Method of manufacturing nozzle plate, and inkjet head

A cleaning apparatus that includes a cleaning member and cleans a detection surface of a detection element included in a detection device includes a fixing unit configured to fix the detection device attached to the cleaning apparatus, an adjustment mechanism configured to adjust a position of the detection device with respect to the cleaning apparatus and a measurement unit configured to measure a position and an inclination of the detection element of the detection device.

Cleaning apparatus and cleaning method for an image sensor

An inkjet head having a metal wiring on a board in an ink flow path or an ink tank includes a base layer and an organic protective layer on the metal wiring, arranged in an order of the metal wiring, the base layer, and the organic protective layer. The base layer has an interface that is in contact with the metal wiring and that includes at least one of a metal oxide and a metal nitride. The base layer has an interface that is in contact with the organic protective layer and that includes at least one of a silicon oxide and a silicon nitride.

Inkjet head and method for producing same

An inkjet head manufacturing method for an inkjet head that includes a head chip including: a nozzle ejecting ink; and a flow path substrate including an ink flow path which communicates with the nozzle and through which the ink flows, the method including: composite substrate manufacturing that is manufacturing a composite substrate including a plurality of regions which forms flow path substrates by being split; first protective film forming that is forming a first protective film on a surface of the composite substrate and an inner wall surface of the ink flow path; splitting that is splitting the composite substrate into the flow path substrates; and second protective film forming that is forming a second protective film on at least an exposed face in a split face of the flow path substrate generated in the splitting, the exposed face being exposed in a surface of the head chip.

Inkjet head manufacturing method, inkjet recording device manufacturing method, inkjet head, and inkjet recording device

A cleaning method by which a cleaning apparatus including a first cleaner and a second cleaner cleans a detection element including a detection surface includes cleaning by the first cleaner the detection surface of the detection element by wind pressure, and wiping the detection surface of the detection element with the second cleaner in a contacted manner, wherein the cleaning by the first cleaner and the wiping by the second cleaner are performed in this order.

Cleaning apparatus and cleaning method

Provided is a hot-dip Al&#x2014;Zn&#x2014;Mg&#x2014;Si coated steel sheet having good corrosion resistance in flat parts and edge parts, and also having excellent worked part corrosion resistance. The hot-dip Al&#x2014;Zn&#x2014;Mg&#x2014;Si coated steel sheet includes a base steel sheet and a hot-dip coating on a surface of the base steel sheet. The hot-dip coating includes an interfacial alloy layer present at an interface with the base steel sheet and a main layer present on the interfacial alloy layer, and contains from 25 mass % to 80 mass % of Al, from greater than 0.6 mass % to 15 mass % of Si, and from greater than 0.1 mass % to 25 mass % of Mg. The Mg content and Si content in the hot-dip coating satisfy formula (1):/(&#x2212;0.6)&#x3e;1.7&#x2003;&#x2003;(1)where Mrepresents the Mg content (mass %) and Mrepresents the Si content (mass %).

Hot-dip Al&#x2014;Zn&#x2014;Mg&#x2014;Si coated steel sheet and method of producing same

According to one embodiment, the plurality of charge storage films are separated in a stacking direction with a second air gap interposed. The plurality of insulating films are provided on side surfaces of electrode layers opposing the charge storage films, on portions of surfaces of the electrode layers continuous from the side surfaces and opposing a first air gap between the electrode layers, and on corners of the electrode layers between the portions and the side surfaces. The plurality of insulating films are divided in the stacking direction with a third air gap interposed and without the charge storage films being interposed. The third air gap communicates with the first air gap and the second air gap between the first air gap and the second air gap.

Semiconductor device and method for manufacturing same

Growing community of inventors

Yokohama, Japan

Yohei Sato