Tachi-s Co., Ltd.

Elpida Memory, Inc.

Ps4 Luxco S.a.r.l.

Yohei Ota

Masaaki Honda

Hiroyuki Nozaki

Norito Akimoto

Tomoki Tago

A vehicle seatincludes: a backrest frameprovided in the backrest, an opening memberhaving an openingthat allows a seat beltextending from the inside of the backrestto pass through toward the front side; and a cover holding platethat holds a covercovering a surface of the backrest. Second holesof the opening member, third holesof the cover holding plateand first holesof the backrest frameare arranged, in the order mentioned, toward the rear side of the backrest, so as to coincide with each other. The opening memberand the cover holding plateare fixed to the backrest frameby screwsinserted in the holesand

Vehicle seat

A seat moves along a rail in the front-back direction of a vehicle. A juxtaposed member (receiving member) extending in the front-back direction of the vehicle is joined to a floor or the seat so as to be located next to the rail. A detected portion is provided either to the juxtaposed member or to a member which is located on the floor side or the seat side which moves relative to the floor or the seat to which the juxtaposed member is coupled. A sensor that detects the detected portion is provided either to the juxtaposed member or to the member located on the floor side or the seat side. As a result of this configuration, the installation position of the sensor is less spatially restricted than the case in which the sensor is provided to the rail.

Seat device

Semiconductor device comprises a memory cell region, a peripheral region, and first wiring. The memory cell region includes a first isolation region, and a first active region provided so as to be divided off by the first isolation region. The peripheral region includes a second isolation region, and a second active region divided off by the first and second isolation regions and protruding from the upper surface of an insulating film located in the first and second isolation regions. The first wiring is buried in portions of a semiconductor substrate within the memory cell region and the peripheral region, so as to extend over the first and second active regions in a first direction. The first-direction width of the second active region is constant.

Semiconductor device

A method of forming a semiconductor device includes the following processes. A first groove is formed in a semiconductor substrate. An insulating film is formed in the first groove. An interlayer insulating film is formed over the semiconductor substrate. A removing process is performed to remove a part of the interlayer insulating film and a part of the insulating film to form an alignment mark in the first groove.

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Tokyo, Japan

Yohei Ota