Canon Kabushiki Kaisha

Yohei Osuki

Hideo Tamura

Takaaki Yamaguchi

Kousuke Kubo

Koichi Omata

Ryoji Oohashi

Yuji Tamaru

Toshio Negishi

Suguru Taniguchi

Sadayoshi Sakuma

Ryo Kasai

Masataka Sakurai

Kengo Umeda

Tsubasa Funabashi

Hidenori Yamato

An element substrate of a liquid ejection head includes an ejection element for ejecting a liquid, a plurality of electrode pads for receiving power for causing the ejection element to eject the liquid, and a sensor for detecting that the liquid has invaded the vicinity of the plurality of electrode pads. The sensor has first wiring connected with one electrode pad of the plurality of electrode pads and second wiring connected with one electrode pad different from the electrode pad connected with the first wiring.

Element substrate, liquid ejection head, liquid ejection apparatus, and manufacturing method

An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.

Element substrate, liquid discharge head, and printing apparatus

To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.

A recording element board has a plurality of heat-generating resistor elements arranged in a row and each of the plurality of heat-generating resistor elements comprises a heat-generating resistor layer and first and second pairs of electrodes connected to the heat-generating resistor layer. The first and second pairs of electrodes contact the heat-generating resistor layer at the opposite surfaces thereof to each other. The first pair of electrodes is formed as vias, while each surface of the second pair of electrodes is inclined so as to gradually reduce the thickness thereof toward the end thereof.

Recording element board, liquid ejection apparatus and method of manufacturing recording element board

A print element substrate comprises: a plurality of heaters configured to cause discharge of droplets; a pad array in which a plurality of pads configured to do electrical connection from an outside are arranged; and a plurality of resistance monitor elements configured to measure resistance values of the plurality of heaters, wherein the plurality of resistance monitor elements are arranged along a direction of the pad array.

Print element substrate, method of manufacturing print element substrate, and method of manufacturing printhead

In a print element substrate: if an amount of a voltage drop when the number of print elements driven simultaneously in a state in which the predetermined voltage is applied with respect to one print element array is largest is set as an amount of a voltage drop of the print element array, and a sum of amounts of voltage drops of the print element arrays assigned to one group is set as an amount of a voltage drop of the group, a difference between a largest value and a smallest value of the amounts of the voltage drops of the M groups is smaller than a largest value of the amounts of the voltage drops of the N print element arrays.

Print element substrate, printhead, and printing apparatus

A print element substrate, comprises: a heater layer; a wiring layer that is connected to the heater layer and is for causing the heater layer to generate heat; an insulating layer arranged on the wiring layer; an anti-cavitation layer arranged on the insulating layer that is for protecting the insulating layer; and a switch that has a control terminal that is pulled-down to a ground, and causes the anti-cavitation layer and the ground to have an electrical connection when the control terminal is in a high-level state.

An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.

Element substrate for liquid ejecting head and wafer

A recording-element substrate includes a substrate including a base member, a pair of electrodes, a heating element formed of a thermal resistor layer between the electrodes, a surface on which an electroconductive film coating the heating element has been formed, and an insulating film between the heating element and the electroconductive film and a flow-path-forming member including walls forming a liquid flow path toward the heating element while being disposed on the substrate's surface side. The substrate includes an electric connecting portion in contact with the electroconductive film to connect the electroconductive film with the base member. The shortest distance between the electric connecting portion and a portion where an angle formed by the walls is 120 degrees or smaller when viewed from a direction orthogonal to the surface is smaller than that between a boundary between the electrodes and the heating element and the portion.

Growing community of inventors

Nagareyama, Japan

Yohei Osuki