Mitsubishi Electric Corporation

Yohei Mikami

Tetsuhiro Fukao

Motoyoshi Koyanagi

Masafumi Takeda

Kazuya Itose

A semiconductor laser device () is placed on a first heating-cooling device (). A probe holder () is attached on a second heating-cooling device (). A measurement probe () is fixed to a distal end of the probe holder (). A fine movement table () moves the second heating-cooling device () and the probe holder () so that a distal end of the measurement probe () contacts the semiconductor laser device (). An inspection apparatus () inputs an inspection signal to the semiconductor laser device () through the measurement probe ().

Semiconductor laser inspection apparatus

A semiconductor laser device () is placed on a first heating-cooling device (). A probe holder () is attached on a second heating-cooling device (), A measurement probe () is fixed to a distal end of the probe holder (). A fine movement table () moves the second heating-cooling device () and the probe holder () so that a distal end of the measurement probe () contacts the semiconductor laser device (). An inspection apparatus () inputs an inspection signal to the semiconductor laser device () through the measurement probe ().

An electronic device inspection apparatus of the present application comprises an inspection table for positioning and holding an electrode disposed on a semiconductor device, a contact element that is formed of a shape memory alloy in a long and thin plate shape and has a base part fixed to the inspection table and a variable part formed in a shape of a spiral at a first temperature and being developed from the spiral at a second temperature; and a measurement circuitry for measuring the semiconductor device by conducting a current to flow into the electrode via the contact element. The axis of the spiral of the variable part is parallel to the electrode face of the positioned electrode and a contact region is formed along a longitudinal direction between the variable part and the positioned electrode at the second temperature.

Electronic device inspection apparatus

A receptacle () includes an optical fiber stub (). A lens () includes an incident-side curved surface (), an emission-side curved surface (), and a barrel () provided between the incident-side curved surface () and the emission-side curved surface (). A receptacle holder () holds the receptacle () so that the lens () and the optical fiber stub () are not in contact but separated from each other. When light out from the optical fiber stub () enters the lens () through the incident-side curved surface (), the light is condensed inside the lens () and then spreads again, and the light out from the emission-side curved surface () is condensed onto a light-receiving surface of the light-receiving device ().

Light-receiving module

A semiconductor light reception module is provided with a stem, a cap covering the stem, a holder superimposed on the cap, and a receptacle inserted into the holder. The holder has a main body section covering the lens in the cap. An opening passing from the opposite side of the cap through the main body section and reaching the lens is provided in the main body section of the holder. A fixing screw is inserted into a screw hole provided in the holder and a screw tip of a screw main body section of the fixing screw abuts against a side surface of the receptacle.

Semiconductor light reception module

An optical module includes: an avalanche photodiode; a power supply terminal; a self bias resistor connected between a cathode of the avalanche photodiode and the power supply terminal; a grounding terminal; and a surge preventing Zener diode having a cathode connected to a connection point between the power supply terminal and the self-bias resistor and an anode directly connected to the grounding terminal.

Growing community of inventors

Nagasaki, Japan

Yohei Mikami