C.uyemura Co., Ltd.

Yohei Kaneko

Tsuyoshi Maeda

Katsuhisa Tanabe

Naoshi Nishimura

Yuhei Oogami

The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.

Palladium plating solution and plating method

The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R, R, and Rrepresent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.

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Osaka, Japan

Yohei Kaneko