Toyota Jidosha Kabushiki Kaisha

Denso Corporation

Mirise Technologies Corporation

Yohei Iwahashi

Jun Saito

Ryota Suzuki

Hidemi Senda

Kensuke Nagata

Katsuhiko Hamasaki

Eiji Kagoshima

Yosuke Maegawa

In a semiconductor device, a first deep layer has a high-concentration region and a low-concentration region in a concentration profile of an impurity concentration along a depth direction. The high-concentration region has a high concentration peak at which an impurity concentration is maximum, and includes a region that is not depleted in an off state. The low-concentration region is closer to a high-concentration layer than the high-concentration region, has a region in which a gradient of change in impurity concentration is smaller than a predetermined value, and is depleted in the off state. A first length between a first position closest to a base layer in the first deep layer and a second position of the high concentration peak is shorter than a second length between the second position and a third position closest to the base layer in the low-concentration region.

Semiconductor device and method for manufacturing the same

A method for manufacturing a semiconductor device includes: preparing a semiconductor substrate; arranging a mask on one surface of the semiconductor substrate; forming opening portions in the mask by patterning so as to expose planned formation regions of the semiconductor substrate where trenches are to be formed; forming the trenches, which extend in a longitudinal direction along a planar direction of the semiconductor substrate, in the semiconductor substrate adjacent to the one surface, by performing a first etching using the mask; forming a rounded portion at an opening end portion of each of the trenches by performing a second etching in a state where the mask is arranged and under a condition that a selectivity of the mask is higher than that of the semiconductor substrate; and arranging a gate insulating film and a gate electrode in each of the trenches, thereby to form trench gate structures.

Method for manufacturing semiconductor device

A method for manufacturing a switching device includes: forming a trench at a top surface of a semiconductor substrate; forming a gate insulation film for covering an inner surface of the trench; forming a gate electrode inside the trench to locate a top surface of the gate electrode below the top surface of the semiconductor substrate; forming an oxide film by oxidizing the top surface of the gate electrode; forming an interlayer insulation film by vapor phase growth at a top surface of the oxide film to locate a top surface of the interlayer insulation film below the top surface of the semiconductor substrate; and forming an upper electrode in contact with the semiconductor substrate at the top surface of the semiconductor substrate and a side surface of the trench located above the top surface of the interlayer insulation film.

Method for manufacturing switching device

A semiconductor device includes a semiconductor element. The semiconductor element has a semiconductor layer, a first-conductivity-type layer, a saturation current suppression layer, a current dispersion layer, a base region, a source region, trench gate structures, an interlayer insulation film, a source electrode, a drain electrode, and a second deep layer. The first-conductivity-type layer is disposed above the semiconductor layer. The saturation current suppression layer disposed above the first-conductivity-type layer includes a first deep layer and a JEFT portion. The base region is disposed above the saturation current suppression layer. The source region and the contact region are disposed above the region. Each of the trench gate structures has a gate trench, a gate insulation film, and a gate electrode. The second deep layer is disposed among the trench gate structures and is connected to the first deep layer.

Semiconductor device and method of manufacturing the same

A manufacturing method of a semiconductor device is provided with an inspecting of a semiconductor substrate by an inspection method, the method including heating the semiconductor substrate, measuring first and second characteristics. The measuring of a first characteristic is performed by bringing a plurality of probes into contact with the heated semiconductor substrate and making a first electric current flow in the semiconductor substrate. The measuring of a second characteristic is performed, after the measuring of the first characteristic, by bringing a plurality of probes into contact with the heated semiconductor substrate and making a second electric current flow in the semiconductor substrate. A number of the plurality of probes used in the measuring of the second characteristic is larger than a number of the plurality of probes used in the measuring of the first characteristic. The second electric current is larger than the first electric current.

Inspection method for semiconductor substrate, manufacturing method of semiconductor device and inspection device for semiconductor substrate

An examination device disclosed herein includes: a power source; an inductor provided between the power source and the semiconductor device; a diode connected in parallel with the inductor, and having an anode connected to a negative side of the inductor and a cathode connected to a positive side of the inductor; and a current cutoff mechanism provided between the power source and the semiconductor device, and configured to cut off an inflow of current to the semiconductor device, wherein the current cutoff mechanism starts to cut off the inflow of the current to the semiconductor device before a timing at which voltage that is applied to the semiconductor device is stabilized, after having experienced a rise to surge voltage, the rise having been triggered by the semiconductor device being turned off, and the current cutoff mechanism completes the cutoff after the timing.

Growing community of inventors

Nisshin, Japan

Yohei Iwahashi