Taiyo Yuden Co., Ltd.

Felica Networks, Inc.

Yohei Ichikawa

Kazuhiro Watanabe

Tetsuo Saji

Kenichi Motodate

Masashi Miyagi

Erika Kumakura

Atsuo Kurokawa

Mark Hsinhsien Chih

The present disclosure relates to an information processing device, an information processing method, a program, and an information processing system each capable of achieving flexible use of a storage region of a secure element. When a trigger is acquired by an external trigger device from the outside, an applet is installed or deleted into and from the secure element according to the type of the acquired trigger. The information processing device and the like of the present disclosure are applicable to an electronic apparatus including a secure element.

Information processing device, information processing method, and information processing system

One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.

Circuit module

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.

Communication module

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate one or both mounting areas of the system section and power circuit section and the mounting area of the first high-frequency processing section. The circuit substrate includes a core layer that is a conductive layer thicker than the other conductive layers and that functions as a ground. Electronic components are arranged in through-holes formed in the core layer.

Growing community of inventors

Tokyo, Japan

Yohei Ichikawa