Shincron Co., Ltd.

Yohei Hinata

Yousong Jiang

Kyokuyo Sai

Yoshiyuki Otaki

Ichiro Shiono

A thin film formation method is provided, by which needless film formation due to trial film formation is omitted and film formation efficiency can be improved. This invention is a method for sputtering targets to form a film A having an intended film thickness of Tas the first thin film on a substrate and monitor substrate held and rotated by a rotation drum and, subsequently, furthermore sputtering the targets used in forming the film A to form a film C having an intended film thickness of Tas the second thin film, which is another thin film having the same composition as the film A; comprising film thickness monitoring steps Sand S, a stopping step S, an actual time acquisition step S, an actual rate calculating step Sand a necessary time calculating step S

Thin film formation method and thin film formation apparatus

An optical film thickness meter capable of measuring an optical film thickness and spectroscopic characteristics highly accurately, and a thin film forming apparatus with the optical film thickness meter are provided. The optical film thickness meter includes a light projector, a light receiver, a monochromator, and a reflection mirror having a reflection surface substantially perpendicularly to the optical axis of measurement light on the side opposite to an actual substrate. The actual substrate is disposed having a predetermined angle to the optical axis. The measurement light passes through the actual substrate twice, whereby a change in transmissivity can be increased, and control accuracy of thickness measurement is improved. Measurement errors caused by a difference in transmission positions is prevented. Since the measurement light which has not passed through the measurement substrate twice is not detected by the light receiver, the optical film thickness and spectroscopic characteristics is measured highly accurately.

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Yokohama, Japan

Yohei Hinata