Ebara Corporation

Hirata Corporation

Yohei Eto

Toru Maruyama

Yasuyuki Motoshima

Tomoatsu Ishibashi

Junji Kunisawa

Hisanori Matsuo

Koichi Fukaya

Fumitoshi Oikawa

Hisajiro Nakano

Mitsunori Komatsu

Teruaki Hombo

Shinji Kajita

Keiji Kanazawa

An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.

Carrier device, work processing apparatus, control method of carrier device and storage medium storing program

An apparatus for cleaning a substrate has a holding unitthat holds a substrate W; a rotated unitconnected to the holding unit; a rotating unitthat is provided on a peripheral outer side of the rotated unitand rotates the rotated unit; and a cleaning unitthat physically cleans the substrate W held by the holding unit

Apparatus for cleaning substrate and substrate cleaning method

A heat exchanger which can allow a surface temperature of a polishing pad to promptly reach a target temperature and can realize a uniform distribution of the surface temperature of the polishing pad is disclosed. The heat exchanger includes a pad contact surface capable of contacting the polishing pad, a heating flow passage through which a heating fluid is to flow, and a cooling flow passage through which a cooling fluid is to flow. The heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.

Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program

A substrate transfer hand is configured to sandwich a substrate between a plurality of receiving members and a gripping member and to fix the substrate by moving the gripping member with an actuator. The plurality of receiving members each have a flat plate-shaped support portion mounted on the main hand body, a substrate outer periphery holding portion supported on the support portion and configured to hold an outer periphery of the substrate, and a substrate lower surface holding portion supported on the support portion and configured to hold a lower surface of the substrate. The substrate outer periphery holding portion has a portion provided vertically from the support portion and configured to hold the substrate in contact with the outer periphery of the substrate. The substrate lower surface holding portion has a portion inclined from an outer peripheral side toward an inner side of the substrate to be held. The substrate outer periphery holding portion and the substrate lower surface holding portion are spaced from each other by a gap or a groove.

Substrate transfer hand

There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

Apparatus and method for regulating surface temperature of polishing pad

Growing community of inventors

Tokyo, Japan

Yohei Eto