Hitachi, Ltd.

Hitachi-high-technologies Corporation

Yohei Asakawa

Makoto Ono

Masato Kobayashi

Hisafumi Iwata

Shigeru Kikuchi

Masaya Takahashi

Toshiya Teramae

Yoshio Koguchi

Hideaki Onozuka

Kanako Harada

Motohiro Kikuchi

There is provided a controlling technique for a servo press capable of optimal forming for handling variability in a sheet thickness and material property of a workpiece and for handling each workpiece. A controlling device for controlling a servo press in accordance with a slide motion data includes: measurement equipment for measuring a forming state of a workpiece, attached to a die for forming the workpiece; a measurement result receiving portion for receiving a measurement result sent from the measurement equipment; and a slide motion data changing portion for changing a slide motion data for forming the same workpiece at scheduled measuring time in accordance with the measurement result received by the measurement result receiving portion.

Controlling device for servo press and servo press equipped with the controlling device

An operation unit executes a process for calling to a main memory first data representative of a result of equipment QC applied to a production unit. A process for reading out to the main memory an amount of change in failure in accordance with particle numbers calculated for individual defect sizes from second inspection data representative of a result of equipment QC is applied to the production unit. Electrical test data of a product processed by the production unit during a period inclusive of the time that the second inspection is carried outis also read to the main memory. A process is also executed for using the amount of change in failure in accordance with the calculated particle numbers and the particle numbers for individual sizes determined from the first inspection data to determine an impact on the product by particles generated in the production equipment when the first inspection data is detected.

Inspection data analysis program, inspection tools, review apparatus and yield analysis apparatus

A program is provided for setting efficiently, and with precision, the inspection conditions of an inspection device that detects particles and deformed patterns in or on products such as semiconductor integrated circuits that are manufactured by simultaneously forming a plurality of products on a single substrate. In particular, the system achieves greater efficiency of the setting of cell comparison regions and the setting of non-inspection regions. Input processing of a product type code, input processing of chip size and configuration information, reading processing of circuit layout data, extraction processing of repeated pattern region coordinates, extraction processing of sparse region coordinates and circuit pattern condition registration processing are sequentially executed.

Inspection condition setting program, inspection device and inspection system

An electrode comprises an electrode main body having a porosity, and the conductivity of the electrode main body at its part ranging from the arc running face to a stated depth is made higher than the conductivity at the section or the conductivity at the part ranging from the back surface to a stated depth. This brings about an improvement in circuit-break performance of a circuit breaker and also prevents the arc running face of the electrode main body from deteriorating.

Sintered body and electrode, method for surface densitication of these, process for manufacturing electrode by this method and circuit breaker

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Yokohama, Japan

Yohei Asakawa