Georgia Tech Research Corporation

Intel Corporation

Adeptdc Co.

Yogendra Kumar Joshi

Andrei G Fedorov

Craig Green

Michael K Patterson

Andrei G Federov

Stephane Launay

Wenming Li

Luis Daniel Lorenzini Gutierrez

Rajat Ghosh

Xiaojin Wei

A cooling system for an electric motor that includes a stator having a plurality of slot windings and a rotor, coaxial with the stator, having a plurality of magnets, includes a coolant inlet to the motor and a coolant outlet from the motor. A coolant pathway is in fluid communication with the inlet and the outlet. Heat is transferable from the slot windings to the coolant pathway. A coolant flows through the coolant pathway and is in a liquid phase as it enters the coolant inlet, changing into a gaseous phase as heat is transferred to the coolant from the slot windings. A cooling loop is in fluid communication with the coolant inlet and the coolant outlet. The cooling loop cools the coolant so that substantially all of the coolant is in the liquid phase when it enters the coolant inlet.

Wick assisted embedded evaporative cooling of motors

A system for providing direct silicon microfluidic cooling for electronics includes a cooling block with a first side and a second side. A plurality of micro-pin fins are disposed on the first side of the cooling block. A thermal interface material layer contacts a second side of the cooling block while a manifold is coupled to the cooling block and faces the micro-pin fins. The manifold has an inlet port and an outlet port for supporting cooling fluid flow between the inlet port and outlet port. The cooling fluid from the inlet port and outlet port also flows between the micro-pin fins for removing heat from the micro-pin fins absorbed by the cooling block from the thermal interface layer. The inlet port and outlet port each further comprise a cooling block port having a first geometry that corresponds with edges of a second geometry formed by the micro-pin fins.

System and method for providing direct silicon footprint microfluidic cooling for electronics

Systems and methods are described herein are directed to determining optimal operating set points in sync with dynamic demand responsive to time-varying events in a data center. The method includes establishing, by a matrix module executing on a computing device, a data matrix of a first set of critical data based on resources in the data center representing dynamic demand, the dynamic demand responsive to the time-varying events in the data center. A decomposition module can generate new critical data based in part on the first set of critical data. A prediction module can determine optimal operating set points using the new critical data. The optimal operating set points for the resources can be transmitted by a communications module to a data center orchestration unit such as a building management module.

Systems and methods for intelligent controls for optimal resource allocation for data center operations

Devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like, are provided herein. In particular, the device includes a composite thermal capacitor including a phase change material and a high thermal conductivity material in thermal communication with the phase change material. The high thermal conductivity material is also in thermal communication with an active regeneration cooling device. The heat from the composite thermal capacitor is dissipated by the active regeneration cooling device.

Devices including composite thermal capacitors

Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.

Briefly described, embodiments of this disclosure include thermal management devices, systems, and methods, convection cooling devices, convection cooling systems, convection cooling methods, hybrid convection/desorption cooling devices, hybrid convection/desorption cooling systems, hybrid convection/desorption cooling methods, are disclosed.

Thermal management devices, systems, and methods

Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.

Growing community of inventors

Atlanta, GA, United States of America

Yogendra Kumar Joshi