Samsung Electronics Co., Ltd.

Yo-Se Eum

Seok-Yong Lee

Sang-Geun Kim

Jeong-Jin Lee

Hee-Sang Yang

Kyoung-Bok Cho

Tea-Seog Um

Yong-Kyun Sun

Ho-Soo Jang

Tai-Kew Choi

An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

Solder ball mounter

A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.

Method of forming external terminals of a package and apparatus for performing the same

A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Equipment and method for cutting package

Growing community of inventors

Cheonan-si, South Korea

Yo-Se Eum