Fuji Electric Co., Ltd.

Yo Sakamoto

Hideaki Takahashi

Tatsuya Karasawa

A semiconductor device fabrication method, including preparing a case having a plurality of connection terminals, and fitting a jig onto the case to protect the connection terminals, tips of the connection terminals protruding from the jig. The method further includes fitting a printed circuit board on the tips of the connection terminals protruding from the jig.

Jig for fabricating semiconductor device

A semiconductor device manufacturing method includes a step of preparing a semiconductor unit, having a first main surface including a heat releasing portion and a second main surface opposite to the first main surface, in which is mounted a semiconductor chip, a step of preparing a cooler having a flat surface, a step of applying a paste including metal nanoparticles to the first main surface of the semiconductor unit or the flat surface of the cooler, a step of bringing the first main surface of the semiconductor unit and the flat surface of the cooler into contact through the paste, and a step of applying a pressurizing force uniform in-plane to the second main surface of the semiconductor unit at the same time as raising the temperature of the paste, thereby sintering the paste and forming a junction layer.

Semiconductor device

A semiconductor device includes an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed above the insulating substrate and fixed to side walls of the outer case at both ends thereof. Each of both ends of the terminal bar at a position close to the side wall of the outer case at a surface on an opposite side to a surface facing the insulating substrate is provided with a pressed groove.

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Matsumoto, Japan

Yo Sakamoto