Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Yo Maeda

Mitsuhiro Inoue

Satoshi Suzuki

Keiji Hazama

Shinichi Ohta

Yoshiharu Nakamura

Shozo Ohashi

A process for packaging semiconductors or integrated circuits including semiconductors involves positioning a lead frame on which semiconductors or an integrated circuit are mounted between two thermoplastic resin moldings, at least one of which moldings has a cavity for holding the semiconductors or the integrated circuit and thereafter integrally joining the thermoplastic resin moldings under heat and pressure to the lead frame. An uneven surface is provided on at least a part of the surfaces to be joined of either or both of the two thermoplastic resin moldings. This uneven surface is formed around the cavity in a thermoplastic resin molding having a cavity or on a surface of the thermoplastic resin molding having no cavity which corresponds to the surface to be joined to the other thermoplastic molding having a cavity. The lead frame is interposed or arranged between the two thermoplastic resin moldings so that at least one void is formed between the uneven surface to be joined of at least one of the two thermoplastic resin moldings and the lead frame. The thermoplastic resin moldings are joined by the application of heat and pressure to the lead frame so that at least a part of the at least one void formed prior to joining remains and in this manner harmful flash is prevented from being formed by molten resin produced under the application of heat and pressure.

Packaging process for semiconductors

The present invention is directed to a hollow frame for a game racket substantially constructed from a first fiber reinforced thermoplastic frame member which continuously provides outside peripheral portions of the tadpole shape of the frame including a head portion, a straight handle portion and a triangular throat portion which connects the head and handle portions, and a second fiber reinforced thermoplastic frame member which integrally provides the inside remaining portions, as viewed in the tadpole plan view, of the head, throat and handle portion, wherein the first and second frame members are joined together so as to form a hollow frame.

Frame of a game racket

A carbon filament wound hollow cylinder comprising at least two carbon filament layers, an inner axial direction-wound layer and an outer circumferential direction-wound layer, characterized in that the modulus of longitudinal elasticity in the circumferential direction of the inner layer is lower than that of the outer layer. Such a cylinder is capable of preventing possible crack formation after shaping owing to its much reduced residual stress exerted due to thermal expansion of a mandrel during shaping and capable of being stably employable as a rotary drum for, ultracentrifugation because compressive stress is exerted effectively to cancel tensile stress caused by thermal stress for causing interlaminer delamination during high speed rotation.

Carbon filament wound cylinder and method of producing the same

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Yuki, Japan

Yo Maeda