Matsushita Electric Industrial Co., Ltd.

Yo Hasegawa

Kazuyuki Okano

Chiharu Hayashi

Yasuhito Isozaki

Masahide Tsukamoto

Akira Nakanishi

Masahiro Nagasawa

Munehiro Tabata

Satoshi Murakawa

Yukihiro Shimazaki

Tatsuo Ogawa

Shizuo Furuyama

Koichi Morimoto

Hiroshi Hatase

Shigeru Yasuda

Kunio Kojima

A temperature sensor for prevention of an overcurrent condition in circuits of electronic equipment such as personal computers. The temperature sensor including a temperature sensitive layer provided on opposing electrodes on an insulating substrate and prepared by suspending an electrically conductive powder in a mixture of a resin obtained by copolymerizing a flexible monomer, a hydrophobic monomer, and a monomer having a glycidyl radical, and a hardening agent; and an electronic equipment employing the temperature sensor.

Temperature sensor and electronic equipment using the same

The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170.degree. C. more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.

Diffusion joining method and a paste used therefor

The copper or its alloys can be bonded to each other or can be bonded to noble metals or to other metals whose surface is covered with a noble metal thin film in an oxidative atmosphere. The surface of the copper or its alloys to be bonded should be covered with the layer of a noble metal thin film or a metal oxide remover or a conductive paste mainly consisting of a copper or copper alloy particles and the metal oxide remover. This method can be applied to a metallurgical industry and also to an electronics industry. This method is especially suitable for the production of a multilayered printed wiring board.

Methods for joining copper or its alloys

A capacitor which includes a dielectric layer, a metal electrode and a capacity adjusting electrode erodable by exposure to light energy, the capacity adjusting electrode being a film made of at least one selected from metallic oxides, metallic nitride and metallic boride.

Laser trimable capacitor

Process for preparing a metal sulfide thin film

Process for producing a base metal thin film and an electronic device

Process for forming thin film of metal sulfides

A resin having a monomer unit structure represented by the formula: ##STR1## can be cured by an actinic irradiation such as electron beam, ultraviolet ray or infrared ray to give a heat-resistant, moisture-resistant, acid- and alkali-resistant and solvent-resistant film which is especially suitable for a paint vehicle resin for use in resistor element or magnetic recording medium. A composition comprising said resin modified by incorporating at least of one monomer or oligomer containing at least one acryl, methacryl or allyl group therein for facilitating the control of the characteristics of a resistor element obtained by using said composition is also disclosed.

Radiation curable resin, paint or ink vehicle composition comprising

Resistor elements made by co-molding of film-resistors comprising conductive powder and polyimide resin and a diallyl isophthalate substrate containing more than 500 ppm inhibitors have good thermal stability and smooth surfaces, and are especially suitable for long life potentiometers for high temperature uses.

Resistor elements

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Nara, Japan

Yo Hasegawa