Asml Netherlands B.v.

Yinglong Li

Jan-Gerard Cornelis Van Der Toorn

Yixiang Wang

Juying Dou

Ronald Van Der Wilk

Ying Luo

Qiang Li

Shibing Liu

Shanhui Cao

Kangsheng Qiu

Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

Method, apparatus, and system for wafer grounding

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San Jose, CA, United States of America

Yinglong Li