Changsha University of Science and Technology

Yinghui Ren

Wei Li

Cong Mao

Yongle Hu

Kun Tang

Mingjun Zhang

Feng Shi

Weidong Tang

Yuanqiang Luo

Gang Wu

Ziyang Chen

Ci Song

Zhuo Wen

The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of HO, NaCO, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.

Electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials

This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.

Electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials

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Hunan, China

Yinghui Ren