Eosmem Corporation

Ying-Yi Wu

Rong-Jie Tu

Chern-Lin Chen

Shuang-Chin Wu

A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.

Fingerprint identification device, mobile device using the same and method for manufacturing fingerprint identification device

A method for taking photo with an extension flash module of a mobile device is provided in the present invention. The mobile device operates in coordination with an extension flash module to achieve fill light while taking photo. The method includes the following steps: detecting a specific event before a flashable period. The flashable period starts from the time at which a last row of photo sensors begins exposure to the time at which a first row of photo sensors ends exposure. The time at which the specific event occurs is a fixed period of time compared to the flashable time. Then, triggering a flash instruction according to a flash delay time and a period from the time at which the specific event occurs to the flashable time, such that the extension flash module flashes during the flashable time.

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Zhubei, Taiwan

Ying-Yi Wu