Applied Materials, Inc.

Seagate Technology Incorporated

Nanyang Technological University

Ying W Wang

Guan Huei See

Arvind Sundarrajan

Ruiping Wang

Chang Bum Yong

Peng Suo

Gregory J Wilson

Michael Robert Rice

Hari K Ponnekanti

Ananthkrishna Jupudi

Pooi See Lee

Nirmalya Maity

Jian Zhao

Swee Tiong Tan

Tao Li

Shang Jiun Wong

Chung Poh Ong

Xundong Dai

Kee Ann Chan

Praveen Kumar Choragudi

Methods of bonding one or more dies to a substrate are provided herein. In some embodiments, a method of bonding one or more dies to a substrate includes: applying a material coating on the one or more dies or the substrate; placing the one or more dies on the substrate so that the one or more dies temporarily adhere to the substrate via surface tension or tackiness of the material coating; inspecting each of the one or more dies that are placed on the substrate for defects; and removing any of the one or more dies that are found to have defects.

Procedure to enable die rework for hybrid bonding

The present disclosure relates to through-via structures with dielectric shielding of interconnections for advanced wafer level semiconductor packaging. The methods described herein enable the formation of high thickness dielectric shielding layers within low aspect ratio through-via structures, thus facilitating thin and small-form-factor package structures having high I/O density with improved bandwidth and power.

Methods of TSV formation for advanced packaging

Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

On-board cleaning of tooling parts in hybrid bonding tool

Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

Methods, systems, and apparatus for tape-frame substrate cleaning and drying

Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

Apparatus for environmental control of dies and substrates for hybrid bonding

Methods and apparatus for processing a substrate are provided herein. For example, a method for hybrid bonding a wafer comprises performing a first vacuum processing procedure on the wafer disposed within a first processing chamber, obtaining at least one of moisture measurements or organic species measurements within the first processing chamber, comparing the obtained at least one of moisture measurements or organic species measurements with a predetermined threshold, and one of when a comparison of the obtained at least one of moisture measurements or organic species measurements is equal to or less than the predetermined threshold automatically performing a second vacuum processing procedure in a second processing chamber different from the first processing chamber on the wafer, or when the comparison of the obtained at least one of moisture measurements or organic species measurements is greater than the predetermined threshold automatically continuing performing the first vacuum processing procedure on the wafer.

Methods and apparatus for vacuum processing a substrate

Methods of forming through-silicon vias in substrates for advanced packaging

A piezoelectric energy harvester comprising: a metal substrate comprising a planar part, a first leg projecting from the planar part and a second leg projecting from the planar part, the metal substrate configured to support a piezoelectric matrix on the planar part between the first leg and the second leg; and a piezoelectric matrix provided on the substrate, the piezoelectric matrix comprising a plurality of adjacent PZT elements.

Piezoelectric energy harvester

A testing apparatus for testing a device or components of a device is presented. It is desirable to simulate the effects of rotary and other forces as well as environmental factors on various components of devices to optimize design improvements so as to increase the quality of the various components and the device or to increase the length of service of the various components and the device.

Multi-axis test apparatus

Growing community of inventors

Singapore, Singapore

Ying W Wang