Hon Hai Precision Industry Co., Ltd.

Massachusetts Institute of Technology

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Scienbizip Consulting(shenzhen)co., Ltd.

Ying-Tso Lai

Shou-Kuo Hsu

Hsiao-Yun Su

Cheng-Hsien Lee

Yu-Chang Pai

Po-Chuan Hsieh

Chien-Hung Liu

Yung-Chieh Chen

Tsung-Sheng Huang

En-Shuo Chang

Shen-Chun Li

Hsien-Chuan Liang

Chun-Jen Chen

Duen-Yi Ho

Wei-Chieh Chou

Dan-Chen Wu

Shi-Piao Luo

Jia-Chi Chen

Chien-Hsun Chen

Paul E Green

Ming-Hsien Cheng

A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

Via system of printed circuit board and method of making same

A capacitor includes a first patterned conductive layer, a second patterned conductive layer and a first patterned dielectric layer. The first patterned conductive layer resembles a comb with internal teeth, and the second patterned conductive layer resembles a comb with external teeth, the internal and the external teeth being interlaced in one plane. A thin first patterned dielectric layer within the same plane is shaped and arranged to infill all the gaps between the teeth. The first patterned conductive layer, the second patterned conductive layer, and the first patterned dielectric layer create a single coplanar layer, and a number of such interconnected coplanar layers are stacked within and contained by a multilayer circuit board.

Capacitor and multilayer circuit board using same

A capacitor includes at least two electrode layers opposite to each other and a dielectric layer positioned between the at least two electrode layers. The at least two electrode layers have opposite polarities. Each electrode layer includes a positive electrode and a negative electrode. The positive electrode includes a plurality of first coupling portions spaced substantially evenly and arranged in parallel. The negative electrode includes a plurality of second coupling portions spaced substantially evenly and arranged in parallel. The positive electrode and the negative electrode of each electrode layer are coplanar, and the plurality of first coupling portions interlace with the plurality of second coupling portions.

Capacitor and multilayer circuit board using the same

An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, and at least two resistors. When a signal transmitted by the circuit board is received by the input pins, a first portion of the signal is directly output from the output pins, a second portion of the signal is reflected by the first resistor and transmitted back to the output pins to output, and a third portion of the signal is reflected by the second resistor and transmitted back to the output pins to output, such that output of the equalizer applies two stages of compensation.

Equalizer for loss-compensation of high-frequency signals generated in transmission channels

A FPCB includes a signal layer, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. At least one high speed signal transmission line is formed on the signal layer. The ground layer has a copper-removed area corresponding to the transmission line. Two ground lines are symmetrically disposed at two opposite sides of the signal transmission line and substantially parallel to the signal transmission line, each ground line and the signal transmission line is spaced at a first predetermined distance. Each ground line and the signal transmission line are spaced at a first predetermined distance.

Flexible printed circuit board

A Marchand balun circuit includes a Marchand balun, an unbalanced matching circuit, and a balanced matching circuit. The Marchand balun includes an unbalanced terminal, and two balanced terminals. The unbalanced matching circuit includes a first and the second impedances which are connected between the unbalanced terminal and ground in series, and a first resistor which is connected between ground and a connection node of the first and the second impedances. The balanced matching circuit includes a third and a fourth impedances which are connected between one balanced terminal and ground in series, a fifth and a sixth impedance which are connected between the other balanced terminal and ground in series, a second resistor which is connected between ground and a connection node of the third and the fourth impedances, and a third resistor which is connected between ground and a connection node of the fifth and the sixth impedances.

Marchand balun circuit

In a computing device, a computerized method and a non-transitory storage medium are applied in checking a stored wiring diagram for high-noise components in close proximity to signal lines. An electronic component is selected in a PCB wiring file. A checking range of the selected electronic component is determined for searching for one or more signal transmission lines which pass within the checking range in the PCB wiring file. Basic information of the one or more signal transmission lines is recorded into a result list which is displayed on a display unit of the computing device.

Computing device and method for automatically checking wiring information

A computing device and a method reads a circuit board layout file from a storage device, and selects a first signal transmission line from circuit board layout file as a target line. The computing device and method computes a distance between the target line and the aggressor line corresponding to each unit sample length. If the distance is more than or equal to a height of a sample region, the computing device and method defines the height of the sample region as a crosstalk space between the target line and the aggressor line corresponding to a unit sample length. Otherwise, if the distance is less than the height of the sample region, the computing device and method defines the distance as the crosstalk space between the target line and the aggressor line corresponding to the unit sample length.

Computing device and crosstalk information detection method

A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5.

Printed circuit board

A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole extends through the printed circuit board. A thermal engraving is defined in the surface of the layer, surrounding the through hole and without being covered by the layer of copper. The thermal engraving includes a first opening and a second opening. The first opening of the thermal engraving faces an output terminal of the power supply, and is non-contiguous with the second opening.

A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.

In a method of managing process factors that influence electrical properties of printed circuit boards (PCBs), n process factors are arranged in an order according to different influence to one kind of electrical property of the PCBs. The different influence is determined by first experiments designed using the Taguchi method. M process factors that have important influence to the electrical property are obtained from the n process factors according to the order to design second experiments. A computing formula for the electrical property is fitted using the m process factors according to simulated results of the second experiments, and a variation range of each of the m process factors is computed according to the computing formula.

Method of managing process factors that influence electrical properties of printed circuit boards

A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.

Differential signal transmission device

A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.

An exemplary probe apparatus includes a fixture, a first probe assembly, a motor, a lead screw, two guide members, a second probe, and a reduction gear unit. The first probe assembly is fixedly attached to the fixture and includes a first probe. The motor has a drive shaft attached to the fixture. The lead screw is coupled to the fixture. The two guide members are attached to the fixture and parallel to the lead screw. The second probe assembly is moveably attached to the lead screw and the at least one guide member, and includes a second probe. The reduction gear unit is coupled to the drive shaft and the lead screw to transmit power from the motor to the second probe assembly through the lead screw. The second probe assembly is configured for moving the second probe towards or away from the first probe along the two guide members.

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Taipei Hsien, Taiwan

Ying-Tso Lai