Altus Technology Inc.

Ying-Tang Su

Ying-Cheng Wu

A chip package () and a lens module () mounted on the chip package are provided. The chip package includes a substrate (), a first chip (), a second chip (), and a cover (). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (). The cover is mounted above the second chip and the wires connected with the second chip.

Digital camera module using stacked chip package

A clamping device () for clamping a digital camera module () includes a base () and two legs (). Two legs extend from two sides of the base. Each leg has at least one foot (). The at least one foot defines an arcuate surface (). The arcuate surfaces cooperatively define a space for receiving the digital camera module.

Growing community of inventors

Miao-Li, Taiwan

Ying-Tang Su