Harris Corporation

Ying-Ming Lee

Frank Daneshgar

Matthew Neil

William Edward Clark

Brett A Pigon

Brinnan C Riley

Joseph B Brief

Robert Grayson Wells

Steven R Sprinkle

Neal Knoblock

James William Carpenter

Interconnect feed devices () are provided for electrically connecting first and second electrical components (). The interconnect feed devices () can include a dielectric shell () with an electrically-conductive coating (), and leads () positioned within individual conduits () of the shell. Each lead () and its associated conduit () can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (). The shell () can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.

Interconnect feed devices for electrical components, and processes for manufacturing same

A circuit card clamp () including a base member (), at least one first wedge member (), and a thermally conductive membrane (). The base member has an elongated shape configured for insertion in a circuit card chassis slot (). The first wedge member is movable relative to the base member in response to a first actuator () for engaging the circuit card chassis slot. The thermally conductive membrane is coupled to the base member and the first wedge member. The thermally conductive membrane has slack for permitting the first wedge member to move relative to the base member between a first clamped position and a second unclamped position. The thermally conductive membrane defines a thermal conductive path () between a circuit card () and the chassis slot for releasably securing a circuit card in the circuit card chassis slot.

Multi-direction wedge clamp

A cam activated circuit card clamp is provided. The circuit card clamp is comprised of a base member (), a leverage arm (), and a cam activation shaft (). The circuit card clamp is also comprised of one or more cams (----), one or more ramp members (----), and one or more wedge members (----). The cam activation shaft is coupled to the leverage arm. The cams are in contact with the cam activation shaft which has one or more compression springs disposed thereon. The cams are adapted to pivot about a pivot shaft when actuated. The cams also have a surface adapted to engage an adjacent wedge member when actuated. Each ramp member has an inclined surface adapted to deflect an adjacent wedge member when the adjacent wedge member is compressed against the ramp member. Each wedge member has a surface adapted to engage an adjacent cam. Each wedge member also has an inclined surface adapted to slidingly engage an adjacent ramp member when compressed together. A method for applying a clamping force to a circuit card is also provided.

Cam activated circuit card clamp

A ruggedized, snap-together, module securely retains a pair of mutually abutting fiber optic interconnect MT ferrules, that have been joined together by a ferrule aligning pin clamp structure. The module includes a generally rectangular base member having a ferrule retention cavity that is configured to retain a pair of MT ferrules and an associated pin clamp assembly therefor. A cover is configured to engage the base in such a manner that the two MT ferrules are firmly held in their intended face-to-face abutting condition as captured between the base and the cover. A bias compression spring is captured between the cover and the base in a manner that facilitates removal of the cover when it is desired to open the module and gain access to the two MT ferrules.

Ruggedized module for securely retaining multi-optical fiber interconnect ferrules

A vibration tolerant electronic assembly may include a base and a first isolation stage including a first frame, at least one first linear bearing coupling the first frame to the base to constrain movement of the first frame along a first coordinate axis, and at least one first damper for damping movement of the first frame. A second similar isolation stage may be coupled to the first isolation stage, and a third similar isolation stage may be coupled to the second isolation stage. Furthermore, an electronic device may be coupled to the third isolation stage. The electronic assembly provides resistance to disturbance of the electronic device by vibration in one or more of three coordinate axis.

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Melbourne, FL, United States of America

Ying-Ming Lee