Xi'an Eswin Material Technology Co., Ltd.

Ying Lu

Wen Zhang

Na Yi

Rongkai Linghu

A processing method for reducing warp of a nitrogen-doped wafer includes dividing a to-be-cut nitrogen-doped crystal ingot into a plurality of to-be-processed crystal ingot segments according to nitrogen content distribution, where each to-be-processed ingot segment corresponds to a nitrogen content range. The method further includes determining a processing condition corresponding to each to-be-processed crystal ingot segment according to correspondences between nitrogen content ranges and processing conditions, where the processing condition enables the corresponding to-be-processed crystal ingot segment to be prevented from warping during wire sawing; and performing cutting processing respectively on the each to-be-processed crystal ingot segment by using the processing condition corresponding to each to-be-processed crystal ingot segment, thereby obtaining a wafer by cutting the to-be-cut nitrogen-doped crystal ingot.

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Xi'an, China

Ying Lu