Interface Optoelectronics (shenzhen) Co., Ltd.

General Interface Solution Limited

Ying-Hung Tsai

Wei-Chung Chuang

Chen-Hsing Huang

Chen-Chu Hsu

Somnath Mondal

A method of manufacturing a piezoelectric element includes: forming a patterned mask layer over a substrate, in which the patterned mask layer has an opening exposing a portion of the substrate; forming a piezoelectric element in the opening; and removing the patterned mask layer to obtain the piezoelectric element, in which the piezoelectric element has a central portion and a peripheral portion adjacent to the central portion, and the peripheral portion has a maximum height greater than a height of the central portion.

Method of manufacturing piezoelectric element and piezoelectric substrate

The present disclosure provides an electronic device. The electronic device includes a fixing structure, a display module, a cover glass, a first adhesive, and a second adhesive. The fixing structure includes a receiving portion and a fixing portion around the receiving portion. The display module is received in the receiving portion. The cover glass is located above the fixing portion and the display module. The first adhesive is located between the fixing portion and the cover glass to adhere the fixing portion with the cover glass. A groove is defined in the first adhesive. A hole is defined in the fixing portion corresponding to the groove. The second adhesive is injected in the groove via the hole to adhere the fixing portion with the cover glass.

Growing community of inventors

Guangdong, China

Ying-Hung Tsai