Himax Technologies, Inc.

Ying-Chou Tu

Biing-Seng Wu

Jiunn-Yau Huang

Kuei-Hsiang Chen

Chia-Hui Wu

Yao-Hwei Lee

A method for driving a flat display is disclosed. Each row of the flat display includes N pixels, that is used to display M pixel data in a row of a image frame, wherein M and N are positive integers and M is larger than N. The method includes, in a first time division, the N pixels display N pixel data out of the M pixel data, and in a second time division, the N pixels display the remaining M-N pixel data.

Flat display and driving method thereof

A display driving circuit including a color correction unit and a driving unit is provided. The color correction unit receives a digital video signal and a polarity signal, and outputs a color corrected video signal according to the received digital video signal and the polarity signal, wherein the polarity signal represents the polarity of the driving polarity applied on the display apparatus. The driving unit receives a color corrected video signal and accordingly has the received color corrected video signal converted into an analog driving voltage. The display apparatus displays the frame on the display panel according to the received analog driving voltage.

Display driving circuit and a display apparatus using the display driving circuit and the method thereof

A semiconductor device comprises a substrate having contact pads each covered by under bump metallurgy and a plurality of bump electrodes respectively provided on the under bump metallurgy covering the contact pads. According to one embodiment of the present invention, the semiconductor device is characterized by having at least one contact pad (e.g., a test contact pad) which is not provided with any bump electrode but still has under bump metallurgy provided thereon. According to another embodiment of the present invention, the semiconductor device is characterized by having at least a conductive line formed of the same material as the under bump metallurgy for interconnecting at least two of the contact pads. The present invention further provides methods of manufacturing the semiconductor devices.

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Tainan County, Taiwan

Ying-Chou Tu