Primax Electronics Ltd.

Asustek Computer Inc.

Ying-Chieh Chuang

Mao-Hsiu Hsu

Hsin-Tso Chen

Chih-hao Hsu

Shen-Yuan Lee

Ching-Chung Tang

A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.

Method for assembling fingerprint identification module

A method for assembling a fingerprint identification module is provided. During the process of cutting a sensing strip, the junction parts between adjacent fingerprint sensors are retained. Consequently, the cut sensing strip is still a one-piece structure. Then, a paint-spraying process is performed to spray paint on the one-piece structure of the sensing strip. After the junction parts are removed, plural individual fingerprint sensors are produced. In comparison with the conventional technology of spraying paint on the individual fingerprint sensors, the assembling time of the method of the present invention is largely reduced. Consequently, the production efficiency of the present invention is enhanced.

A method for assembling a fingerprint identification module is provided. During the process of cutting the sensing strip, the thin junction slices between the fingerprint sensors are retained. Consequently, the size of the top surface of the fingerprint sensor is close to a predetermined size. After the thin junction slices are cut, the concave structures are formed on the bottom surfaces of the fingerprint sensors. Consequently, the size of the bottom surface of the fingerprint sensor is smaller than the size of the top surface of the fingerprint sensor. Even if the cutting skew is generated during the cutting process, the fingerprint sensor can pass the size test. Consequently, the production efficiency is enhanced.

Method for assembling fingerprint identification module and fingerprint sensor cutting method

The present invention provides an antenna structure. The antenna structure includes a main board, at least having a signal feeding portion; a bearing component, connected to the main board and at least having a protrusive portion; and an antenna, connected to the bearing component and at least having a pin portion, wherein the pin portion is disposed on the protrusive portion, and the signal feeding portion and the pin portion contact with each other.

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Taipei, Taiwan

Ying-Chieh Chuang