Delta Electronics, Inc.

Au Optronics Corporation

Ying-Chi Chen

Wen-Shi Huang

Te-Tsai Chuang

Kuo-Cheng Lin

Ming-Shi Tsai

Lee-Lung Chen

Tse-Hsin Wang

Tsung-Lin Lu

Kuo-cheng Lin

Lee-Long Chen

Hung-Chi Chen

Chien-Ming Lee

Ming-shi Tsai

Chien-Hsiung Huang

Peng-Chu Tao

Wu-Chi Li

Zse-Hsin Wang

Shih-Kai Lin

Deng-Chu Fu

Shiang-Chiang Liu

Ja-Jeng Lu

Wu-Chi Lee

Ya-Sen Ty

Huan Chi Chen

William Lu

A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.

Heat exchange device

A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.

Shelf thermostat device and thermostat system

An air-cooled heat exchanger includes a casing, a first heat-exchanging core, a second heat-exchanging core, a first internal driving device, a second internal driving device and an external driving device. The first internal driving device is used for driving a first internally-circulated airflow to flow along a first internal circulation path. The second internal driving device is used for driving a second internally-circulated airflow to flow along a second internal circulation path. The external driving device is used for driving a first externally-circulated airflow to flow along a first external circulation path and driving a second externally-circulated airflow to flow along a second external circulation path. The first heat-exchanging core is configured to perform heat exchange between the first internally-circulated airflow and the first externally-circulated airflow. The second heat-exchanging core is configured to perform heat exchange between the second internally-circulated airflow and the second externally-circulated airflow.

Air-cooled heat exchanger and electronic device with same

A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.

Heat-dissipation structure for motor

A motor comprises a base, a rotor, a stator, and a circuit board. The base includes a sleeve. The stator includes at least one fastener. The sleeve has an inclined outer surface. The fastener extends to the circuit board and abuts the inclined outer surface to fasten the circuit board. A fan comprises a base, a hub, a shaft, a circuit board. The base has a sleeve. The hub comprises a plurality of blades disposed outwardly thereof. The shaft connects to the sleeve and is disposed in the hub. The stator has at least one fastener. The sleeve has an inclined outer surface. The fastener extends to the circuit board and abuts against the inclined outer surface to fasten the circuit board.

Fan motor having fixing structure for circuit board

A wire-fixing element is coupled into an opening of a base. A wire passes through the opening, and one part of the wire is disposed in the base. The wire-fixing element includes a first end and a second end. A pair of arms is disposed at the first end and the arms are buckled into the opening. A supporting member is disposed at the second end and is used for supporting the wire.

Base assembly and wire-fixing element thereof

A stator structure includes a first cover, a stator assembly and a filler. The first cover has an accommodation space for accommodating the stator assembly therein. The filler is applied between the first cover and the stator assembly to surround the stator assembly. A manufacturing method of the stator structure is also disclosed.

Stator structure and manufacturing method thereof

A substrate transportation device includes a housing for transporting substrates. The housing is formed of an upper surface, a lower surface, and opposing sidewalls. The housing has a rear opening through which the substrates enter the housing and a front opening through which the substrates exit the housing. A plurality of hollow supporting members are disposed within the housing and affixed to the opposing sidewalls which are formed by a plurality of columns. The hollow supporting members have a plurality of apertures in an upper surface for supplying a medium to a lower surface of the plurality of substrates. A medium supply member transfers the medium toward the hollow supporting member. The medium transferred by the medium supply member is delivered through the apertures in the upper surface of the plurality of hollow supporting members to float the substrates on a cushion of air.

Substrate transportation device (air)

A heat dissipation device and fan module. The fan module is fixed to a fan tray, which has a track with a first engaging portion. A securing member is disposed on a shield, comprising a second engaging portion. The second engaging portion enters the first engaging portion, fixing the fan module to the fan tray. An actuator connects the securing member and the shield. When external force deforms the actuator, the securing member deforms therewith, withdrawing the second engaging portion from the first engaging portion.

Heat dissipation device and fan module thereof

A fan and a rotor structure thereof. The rotor structure has a case, an upper linking structure, a lower structure, and a rotating shaft. The case has an opening at the axle center. The upper linking structure has a fixing portion and a threaded portion. The minimum radius of the fixing portion is longer than the radius of the opening. The threaded portion is disposed in the opening. The lower linking structure has a thread corresponding to the threaded portion. The upper linking structure and the lower linking structure is screwed together to secure the case therebetween. The rotating shaft is fixed in the upper linking structure or the lower linking structure.

Fan and rotor structure thereof

A connecting device of a hot swap fan module comprises at least one terminal and a casing. The at least one terminal is electrically connected to the fan so that, when the fan is mounted in a system, electrical connection is formed between the fan and the system. The connecting device further comprises at least one LED (light emitting diode) which is electrically connected to the fan or the at least one terminal for indicating the operating state of the fan, and at least one cover plate protruded from at least one edge of the casing so as to form the whole casing into an L or U-shaped structure. The casing is closely attached to one side face of the fan housing when the casing is assembled to the fan. The casing also has a recess for receiving those lead wires electrically connecting the terminals, the fan, and the LED.

Hot swap fan connecting device thereof

An ionizer for eliminating static electricity on a large size substrate. The ionizer comprises a bar and a plurality of pin sets. The pin sets are located on the bar at a given interval, and a power line is located inside the bar. Each pin set comprises a plurality of pins and a plurality of nozzles. The pins connect to the power line, and the nozzles are located around the pins to spray charges on the substrate at a given spraying angle. By setting more pins in each pin set, the covering angle of the ionizer can be enlarged.

Ionizer

A display circuit board is provided for a heat dissipation system. The heat dissipation system includes a fan tray, a control circuit board, a plurality of fans, and a display circuit board. The display circuit board includes a plurality of light emitting diodes (LEDs), a thermal sensor, and a connector. After the thermal sensor detects the temperature around the heat dissipation system and transmits a temperature signal to the control circuit board through a signal transmitting cable, the control circuit board adjusts the rotation speeds of the plurality of fans according to the temperature signal, and further transmits a plurality of display signals, which indicate the operation situation of the plurality of fans to the corresponding LEDs through the signal transmitting cable.

Growing community of inventors

Taoyuan Hsien, Taiwan

Ying-Chi Chen