Taiwan Semiconductor Manufacturing Comp. Ltd.

Ying-Chen Chiu

Po-Jen Wang

Hsiang-Hui Tsai

A method for controlling device feature sizes produced by polishing operations such as chemical mechanical polishing (CMP) is provided. The method includes instituting process controls to control the processing operations used in combination to produce features of a metal layer with a desired thickness, based on the thickness of the previous metal layer or layers. A target thickness for first and second metal layers is established. After the first metal layer is produced and the difference between the first metal target thickness and the actual first metal thickness is determined, the target thickness for the second metal features is adjusted. Once the target thickness for the second metal features is adjusted, each of the processing operations used to produce the second metal layer is controlled in combination to produce the second metal features with the adjusted target thickness.

Growing community of inventors

Kaohsiung, Taiwan

Ying-Chen Chiu