Macronix International Co., Ltd.

Industrial Technology Research Institute

Energy Pass Incorporation

Richtek Technology Corporation

Mxtran Inc.

Afa Micro Co.

Ying-Che Lo

Albert C Sun

Pao-Chieh An

Chee-Horng Lee

Wenpin Lu

Eric Sheu

Ming-Shang Chen

Mam-Tsung Wang

Yu-Sheng Lin

Huan-Chin Luo

Ting-Hao Hsiao

Chia-Hsieh Wu

Chao-Ta Huang

Ming-Hung Chou

Yu-Wen Hsu

Po-Jen Su

Bor-Shiun Lee

Chia-Shing Chen

Chao-Hsuan Liu

Shyh-Shyan Liao

Hsueh-Wen Tseng

Yi-Cheng Chen

Chun-Lien Su

Yu-Ying Lin

Chih-Hsien Wang

Hung-Chi Huang

Ming-Chieh Chou

Chia-Yu Wu

Yao-Hui Lee

Ming-Fa Chen

Lu-Po Liao

Baw-Chyuan Lin

Lu-Shan Chiang

Li-Tao Teng

Chi-Wang Pang

Chungming Glendy Sun

Hsin-Tang Chien

Fa-Jung Wang

Hung-Tsai Yen

Chih-Yi Hsiao

Chia-Jui Shen

Lupu Liao

Po-Chih Lai

Kung-Hua Lee

Chung-Yi Hsu

Ming-Jye Chiou

Shyh-Hong Tseng

A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.

Sensing devices and calibration method thereof

A sensing device is provided. The sensing device includes a plurality of infrared thermosensitive elements and a plurality of resistor-capacitor (RC) oscillators. The plurality of infrared thermosensitive elements are arranged in an array. Each of the plurality of infrared thermosensitive elements has a resistance value which changes with a temperature of the infrared thermosensitive element by absorbing infrared radiation and generates a sensing voltage corresponding to the resistance value. The plurality of RC oscillators are coupled to the plurality of infrared thermosensitive elements to receive the corresponding sensing values, respectively. Each of the plurality of RC oscillators generates a digital sensing signal according to the corresponding sensing value to indicate the temperature of the corresponding infrared thermosensitive element. Each of the plurality of RC oscillators is disposed under the corresponding infrared thermosensitive element.

Sensing devices

A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.

Microelectromechanical infrared sensing apparatus having stoppers

A gas sensing device is adapted to detect a concentration of a target gas. The gas sensing device comprises a dielectric layer, a reference sensing portion, a target sensing portion, and a controller. The dielectric layer is disposed on a surface. The reference sensing portion and the target sensing portion are respectively disposed on a supporting side of the dielectric layer, with said supporting side facing away from the surface. The reference sensing portion includes a first conductive layer and a first sensing layer with low sensitivity to the target gas. The target sensing portion includes a second conductive layer and a second sensing layer with high sensitivity to the target gas. The controller obtains the immittance values of the first conductive layer and the second conductive layer, and calculates a concentration value of the target gas according to the immittance values and a correlation function.

Gas sensing device and gas concentration sensing method

An optical encoder includes an encoding disk and an optical detector disposed to correspond to the encoding disk. The optical detector includes a plurality of optical sensors arranged to form an optical sensor array. The optical detector is provided to receive light. The optical detector includes at least one optical sensor arranged to form at least one sensor array. The width of the sensor array corresponds to an interpolation period of the optical encoder.

Optical encoder comprising a width of at least one optical sensor array corresponds to an interpolation period of the encoder

A resistive gas sensor is provided. The resistive gas sensor includes a sensing circuit and a determination circuit. The sensing circuit senses a gas to generate a detection signal. The determination circuit performs a frequency-division operation on the detection signal by a frequency-division parameter to generate a frequency-division signal, counts a half of a period of the frequency-division signal to generate a half-period count value, and determines concentration of the gas according to the half-period count value. The determination circuit determines the frequency-division parameter according to the half-period count value.

Resistive gas sensor and gas sensing method therefor

A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

Micro-electromechanical apparatus for thermal energy control

The present invention discloses an event detection method for waking up a portable electronic device and an action sensor using same. The event detection method includes the steps of: under a normal operation mode, sensing action events by the action sensor with a first data sensing frequency, wherein the action sensor operates by a normal current to detect the action events; entering into a sleep mode; under the sleep mode, detecting a wake-up event by the action sensor with a second data sensing frequency, wherein the action sensor operates by a weak current to detect the wake-up event, wherein the weak current is smaller than the normal current, and the second data sensing frequency is not higher than the first data sensing frequency; and returning to the normal operation mode when the wake-up event is detected.

Event detection method for waking up a portable electronic device and action sensor using same

This invention provides a signal processing method of multiple micro-electro-mechanical system devices. The signal processing method includes: providing at least two MEMS devices; applying driving or modulating signals of different frequencies to the MEMS devices such that the MEMS devices generate respective MEMS signals with respective frequencies; and combining the MEMS signals with respective frequencies into one or more multi-frequency signals and outputting the multi-frequency signals, wherein a number of the multi-frequency signals is less than a number of the MEMS signals with respective frequencies. This invention also provides a combo MEMS device integrating two or more MEMS devices and two or more vibration sources.

Signal processing method of multiple mirco-electro-mechanical system (MEMS) devices and combo MEMS device applying the method

A temperature-controlled power supply system is disclosed. The temperature-controlled power supply system comprises a power source, for supplying input power; a rechargeable battery module, for receiving the input power for power storage; a charging unit, coupled between the power source and the rechargeable battery module, for charging the rechargeable battery module with the input power; a temperature sensing unit, coupled to the rechargeable battery module, for sensing a temperature of the rechargeable battery module; and a current control unit, coupled to the temperature sensing unit and the charging unit, for controlling a current for charging the rechargeable battery module according to the temperature of the rechargeable battery module.

Temperature-controlled power supply system and method

A configurable power supply system is disclosed. The configurable power supply system comprises a power source for providing input power, a switch, coupled to the power source, for enabling a bypass path for outputting the input power to an output node as an output power when turned on; a rechargeable battery module for storing the input power for outputting a battery power; a charging unit, coupled between the power source and the rechargeable battery module, for charging the rechargeable battery module with the input power; a converting unit, coupled to the rechargeable battery module, for converting the battery power to generate the output power; and a control unit, coupled to the switch, the charging unit, and the converting unit, for controlling functions of the switch, the charging unit, and the converting unit.

Configurable power supply system

An apparatus for measuring a remaining power of a battery unit includes a first memory unit, a second memory unit, and a processor. The first memory unit stores a first program code. The second memory unit stores a second program code. The second memory unit is accessed at a second speed that is lower than a first speed at which the first memory unit is accessed. The processor is utilized for reading the first program code from the first memory unit to execute calculation for current of the battery unit during a normal operation mode and reading the second program code from the second memory unit to execute an exception during the normal operation mode if required.

Apparatus for measuring a remaining power of a battery includes a first memory for storing a routine code and a second memory for storing an exception code

A wireless wrist mouse, used with an apparatus including a display having a cursor, has a body mountable to a user's hand/wrist by wrist mounting structure. A motion sensor and motion circuitry are carried by the body and are operably connected to one another. The motion circuitry includes a library of command motions. The motion circuitry is constructed to generate first and second command signals corresponding to the first and second command motions when the body has been moved in predetermined manners for receipt by and operation of the apparatus. The first command signals correspond to cursor movement directions for controlling movement of the cursor over the display. The second command signals correspond to control functions for the apparatus. In some examples, the motion sensor comprises a MEMS sensor. In some examples, the motion sensor comprises a translational, rotational, and vibrational movement motion sensor.

Motion sensitive gesture device

A carrier and a frame, movable relative to one another in both an x-y direction and a z direction provide a test bed for MEMS like integrated circuits. The carrier includes receptacles mounted on a test substrate. The frame includes pins projecting from a surface of a plate. The plate has open areas. In a test sequence, the frame and carrier are oriented so that the cavities are exposed by open areas of the plate; a tool is used to place a device to be tested in each cavity; the frame and carrier are moved into alignment and toward one another to bring the pin ends into contact with the devices in the cavities. Then a test cycle is carried out. Following the test cycle the process is reversed to expose the devices for a pick-and-place tool to remove and bin the tested devices.

Integrated circuit device test apparatus

A transaction operations server receives multiple transactions of the mobile communication device. One transaction adds a first amount of money to the stored value represented by data on the mobile communication device, and another transaction subtracts a second amount of money. The amounts of money are in different data types each representing different business issued currencies each honored by a particular group of businesses. The transaction operations server exchanges the money represented by data on the mobile communication device between the different data types. Other embodiments include a method of exchanging money as described, an a data structure supporting the exchange of money as described.

Method and apparatus to manage mobile payment account settlement

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Hsinchu, Taiwan

Ying-Che Lo