Digital Optics Corporation

Yinbao Yang

Xiansong Chen

Michael R Feldman

James E Morris

Hongtao Han

Etching in combination with other processing techniques is used to facilitate alignment of an optical die in an optical system. The optical dies are formed on a wafer level and need to be singulated for use in the optical system. The formation of a precise edge from etching allows more accurate alignment of the optical die in the optical system. The other processing techniques include dicing, sawing, cleaving, breaking and thinning.

Etching in combination with other processing techniques to facilitate alignment of a die in a system and structures formed thereby

A wavelength monitor includes: a splitter on an optics block dividing an input beam into a first portion and a second portion; a first detector and a second detector; a wavelength selective element in an optical path of one of the first and second portions before a respective detector; and an optical bench on which the splitter, the first and second detectors, and the wavelength selective element are mounted. The optical bench may include a hole through which an application beam, separate from the first and second portions, is to pass. The optical bench may include a reflective surface below an active area of the detectors for directing the light onto the active areas.

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Charlotte, NC, United States of America

Yinbao Yang