Emcore Corporation

Intel Corporation

Neophotonics Corporation

Yinan Wu

Andrew J Daiber

Shengbo Xu

John R Benham

Boyang Liu

Yun Ling

Karl W Wyatt

Scott L Noble

Tao Liang

John Critchlow

John M Lynch

Daniel Willis

Frank Lei Ding

Mark E Naylor

Vincent Nguyen

Guixiang Tan

Paul Ludwig

Brent A Hill

Cary D Cottrell

Thai (Daniel) Tong

Support for a beam splitter

A tunable laser configured in a small package coupled to a printed circuit board. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A beam splitter and photodiode is disposed in the path of the laser beam for determining the emitted intensity of the laser beam, and an optical isolator is positioned downstream of the beam splitter to prevent the incoming light from the beam splitter from reflecting back though the beam splitter and into the cavity of the laser.

Small packaged tunable laser assembly

A laser assembly and a method for manufacturing the same are provided according to embodiments of the present disclosure. The laser assembly () may comprise a first plate () having first projections (); a printed circuit board assembly () including a printed circuit board () having first openings () and a laser module () thereon, and a second plate () having second projections (). The printed circuit board assembly () can be retained between the first plate () and the second plate () by the first projections () and the second projections (). The laser assembly may further comprises a first pad () provided between the laser module () and the first plate () and/or a second pad () provided between the laser module () and the second plate (). Any of the first pad () and the second pad () may be adaptable to be compressed, and adaptable to hold the laser module () or to hold the laser module () and to dissipate the heat from the laser module ().

Laser assembly and method for manufacturing the same

According to one embodiment, the present application includes a tunable laser configured in a small package. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing and configured to receive an information-containing electrical signal. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A tunable semiconductor laser is positioned in the interior space and operable to emit a laser beam having a selectable wavelength. A focusing lens assembly is positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface.

Small packaged tunable laser with beam splitter

Tunable Laser Assembly

An electronic system includes a system board, a connector mounted on the system board, an electronic card attached to the connector, the card overhanging the connector at least on an inward end of the card, and a guide secured to the system board and spaced from the connector, wherein the guide is adapted to inhibit lateral movement of the card. The guide includes a latch adapted to inhibit removal of the electronic card from the connector.

Multi-axis retention mechanism

A connector is configured for insertion and removal of a digital device. The connector has contacts arranged to make electrical connection to conductors on the digital device while the digital device is inserted in the connector. A first electromagnetic coupler is connected to at least one of the contacts of the connector. The electromagnetic coupler is configured for electromagnetic coupling at an interface to a second electromagnetic coupler that is connected to a communication bus.

Electromagnetic bus coupling

An assembly (for example, an assembly in the form of an interposer that is distinct from a motherboard and from the devices that communicate with the motherboard) includes electromagnetic couplings. Each of the electromagnetic couplings couples signals being communicated between a device and a bus. Each of the electromagnetic couplings is connected to (a) an associated bus connector to provide connections of the couplings to the bus, and (b) an associated device connector to provide connections of the couplings to the device.

Electromagnetic bus coupling having an electromagnetic coupling interposer

Growing community of inventors

Westborough, MA, United States of America

Yinan Wu