Applied Materials, Inc.

Apple Inc.

Yin Yuan

Hung Chih Chen

Gautam Shashank Dandavate

Samuel Chu-Chiang Hsu

Huanbo Zhang

Jeonghoon Oh

Gopalakrishna B Prabhu

Gregory E Menk

Shou-Sung Chang

Craig Matthew Stanley

Glenn K Trainer

Jason C Della Rosa

Mario David Silvetti

Stephen Jew

Yanchu Xu

Alexander R Gould

Junyi Yang

An electronic speaker can include: a device housing that defines an interior housing cavity; an audio driver disposed within the interior housing cavity; and a foot assembly coupled to the device housing and operable to support the electronic speaker. The foot assembly can include: a foot assembly sidewall having an outer sidewall perimeter extending outwardly away from a central neck; a planar foot having an outer foot perimeter proximate the outer sidewall perimeter where an upper surface of the planar foot cooperates with an interior surface of the foot assembly sidewall to create an internal cavity within the foot assembly; a suspension system disposed within the foot assembly internal cavity and coupling the planar foot to the foot assembly sidewall. The suspension system can include: an isolator plate disposed within the internal cavity of the foot assembly and mechanically coupled to the planar foot where the isolator plate includes a channel projecting perpendicularly away from the planar foot towards the device housing; an isolator stop fitted within the channel and having an aperture formed through the isolator stop aligned with a length of the channel; and an isolator fastener coupled to the foot assembly sidewall and disposed within the channel. The isolator fastener can extend through the isolator aperture formed through the isolator stop and can be operable to allow the foot assembly sidewall to translate with respect to the planar foot.

Electronic speaker with a planar foot

A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

Inner retaining ring and outer retaining ring for carrier head

A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.

Side pad design for edge pedestal

An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.

A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.

Carrier head with narrow inner ring and wide outer ring

Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.

Retaining ring with shaped profile

Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the basin wall has a substantially leveled top surface, the basin wall and the pedestal plate define a basin configured to retain a liquid therein, and a liquid port opening to the basin, wherein the liquid port is configured to flow a liquid to the basin and allow the liquid to overflow from the basin wall, and a top surface of the overflow liquid in the basin is configured to support a substrate without contacting the basin wall or the pedestal plate.

Growing community of inventors

Santa Clara, CA, United States of America

Yin Yuan