Applied Materials, Inc.

Yin Wei Lim

Prayudi Lianto

Eric J Bergman

John Leonard Sudijono

James S Papanu

Arvind Sundarrajan

Guan Huei See

Peng Suo

Vicknesh Sahmuganathan

Wei Ying Doreen Yong

Remus Zhen Hui Koh

Nur Yasmeen Addina Mohamed Helmi Isik

Satwik Swarup Mishra

Krishnaprasad Reddy Mallavaram

Khor Wui Cheng

Yi Kun Kelvin Goh

Si En Chan

Sachin Dangayach

Rohith Cherikkallil

Rahul Reddy Komatireddi

Sneha Rupa Kongara

A method and apparatus for training a learning model for automatic defect detection and classification of at least a portion of a processed wafer include receiving labeled images having defect classification types and features for portions of a post-processed wafer, creating a first training set comprising the received labeled images, training the machine learning model to automatically classify wafer portions based on at least one detected defect in respective wafer portions using the first training set, receiving labeled wafer profiles having respective downstream yield data, creating a second training set comprising the labeled wafer profiles and training the machine learning model, using the second training set, to automatically determine a respective downstream yield of a wafer based on a respective wafer profile. The machine learning model can be applied to at least one unlabeled wafer image to determine at least one defect classification for at least one portion of a wafer.

Defect classification of processed wafers

Methods and apparatus for processing a substrate are provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of the substrate, b) supplying at least one of microwave power or RF power at a frequency from about 1 kHz to 10 GHz and a power from about 1 kW to 10 kW to the plasma processing chamber to maintain the water vapor plasma within the processing volume during operation, and c) continuing a) and b) until the bonding surface of the substrate has a hydrophilic contact angle of less than 10°.

Water vapor plasma to enhance surface hydrophilicity

Growing community of inventors

Singapore, Singapore

Yin Wei Lim