Himax Technologies, Inc.

Yin-Dong Lu

Han-Yi Kuo

Han-Ching Lin

Kuan-Ming Chen

Shi-Jen Wu

Biing-Seng Wu

Meng-Ko Tsai

Yu-Feng Yen

Chih-Sheng Chang

Chuan-Hui Yang

Teng-Te Huang

Bo-Han Lyu

Chih-Yu Chuang

Yun-Lien Hsiao

Chung-Hsiang Wang

The optical component includes a first substrate, a first diffractive layer formed on the first substrate, a second substrate, a second diffractive layer formed on the second substrate, and a bonding material disposed between the first substrate and the second substrate and connecting the first substrate and the second substrate. The second diffractive layer is disposed opposite to the first diffractive layer, and both the first diffractive layer and the second diffractive layer are located between the first substrate and the second substrate. A gap is formed between the first diffractive layer and the second diffractive layer.

Optical element including at least two diffractive layers

The present invention provides a projector including a laser module and a lens module, wherein the lens module includes a plurality of lens and a plurality of diffractive optical elements. In the operations of the projector, the laser module is arranged to generate at least one laser beam; each of the lenses is arranged to receive one of the at least one laser beam to generate a collimated laser beam; and the diffractive optical elements correspond to the lenses, respectively, and each of the diffractive optical elements is arranged to receive the collimated laser beam from the corresponding lens to generate an image. The images generated by the diffractive optical elements form a projected image of the projector. By using the projector of the present invention, the projected image may have higher resolution or field of view that is advantageous for the 3D sensing system.

Multi-image projector and electronic device having multi-image projector

A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.

Projector, 3D sensing module and method for fabricating the projector

A light wave-guide optical element for use in a head-mounted display (HMD) or in a head-up display (HUD) includes an organic optical material, an anti-reflection stack and an organic optical cover. The organic optical material includes multiple bulging tips surrounded by a periphery plane. The anti-reflection stack conformally covers the bulging tips and the periphery plane. The organic optical cover correspondingly covers the anti-reflection stack, the periphery plane and the bulging tips.

Light wave-guide optical element and method for forming the same

The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.

Method for fabricating small right angle prism mirrors involving 3D shape on optical glue layer

The present invention provides a projector including a substrate, a laser module and a lens module. The laser module is positioned on the substrate, and a laser diode of the laser module is not packaged within a can. The lens module is arranged for receiving a laser beam from the laser diode of the laser module to generate a projected image of the projector.

Projector, electronic device having projector and associated manufacturing method

An equipment for testing a plurality of projector modules is provided, wherein the equipment includes a screen, a mask, at least one camera and a controller. The mask is positioned between the screen and the projector modules when the projector modules are within the equipment, and the mask is arranged to mask a plurality of projected images generated by the projector modules so that only a portion of projected images is allowed to be projected to the screen. The camera is arranged for capturing the portion of projected images on the screen. The controller is coupled to the camera, and is arranged for analyzing the captured images to control settings of the projector modules.

Active alignment equipment and associated method for testing a plurality of projector modules

A collimating lens module and a light source module using the same are provided. The collimating lens module includes a first lens, a second lens, a third lens, a fourth lens and a fifth lens. The first lens is configured for receiving light, wherein the first lens is a negative aspheric lens. The second lens is disposed on the first lens, wherein the second lens is a positive lens. The third lens is disposed on the second lens, wherein the third lens is a negative lens. The fourth lens is disposed on the third lens, wherein the fourth lens is a positive lens. The fifth lens is disposed on the fourth lens, wherein the fifth lens is a positive aspheric lens and configured for outputting collimated light. The light source module includes the collimating lens module and a light emitting diode (LED).

Collimation lens module and light source module using the same

A projector assembling equipment includes a holder and at least one multi-axial adjusting device. The lens module or the light source module is disposed on the holder. The multi-axial adjusting device is connected with the holder to move the holder relative to a reference plane, and the reference plane is used to put the lens module or the light source module which is not held by the holder. The multi-axial adjusting device includes a three-axis adjusting mechanism, a rotary adjusting mechanism and a tilt adjusting mechanism. The three-axis adjusting mechanism is utilized to shift the holder at a first direction, a second direction and a third direction. The rotary adjusting mechanism is disposed on the three-axis adjusting mechanism to rotate the holder at a clockwise direction and a counterclockwise direction. The tilt adjusting mechanism is disposed on the three-axis adjusting mechanism to recline the holder relative to the reference plane.

Projector assembling equipment

A packaging structure of a laser diode is provided. The packaging structure of the laser diode includes a laser chip, a first substrate and a second substrate. The first substrate having a first electrode and a second electrode on a first surface of the first substrate, and the laser chip is disposed on the first surface of the first substrate; and a second substrate having a third electrode and a fourth electrode on a second surface of the second substrate, wherein the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by a wireless-bonding process, respectively.

Packaging structure of laser diode

A wafer level lens system includes a target lens and a wafer level lens group. The target lens includes a first surface, a second surface, and a first fitting structure. The second surface is opposite to the first surface. The first fitting structure is disposed at the second surface. The wafer level lens group includes a first transparent plate and a second fitting structure. The first transparent plate has a third surface and a fourth surface opposite to the third surface. The second fitting structure is disposed on the third surface. The first fitting structure is fitted into the second fitting structure, and there is a space encapsulated between the second surface and the third surface.

Wafer level lens system and method of fabricating the same

A lens module includes a lens set and a prism. The lens set has a first light emitting surface and a first engaging structure, wherein the first engaging structure is formed on the first light emitting surface. The prism is disposed adjacent to the lens set. The prism has a light incident surface and a second engaging structure, wherein the second engaging structure is formed on the light incident surface. The lens set and the prism are assembled with each other by engaging the first engaging structure with the second engaging structure.

Lens module

An image-capturing assembly is disclosed. The image-capturing assembly includes an array of lens units and an array of optical sensor units. At least one of the lens units includes a first functional lens and a first light-blocking member having an aperture. Each of the optical sensor units includes an image-capture element corresponding to one of the lens units. The first functional lens, the aperture of the first light-blocking member, and one of the image-capture element are arranged along an optical axis, and the aperture of the first light-blocking member is asymmetrical with respect to the optical axis.

Image-capturing assembly and array lens units thereof

An imaging lens system includes a lens and a transparent plate. The lens is disposed between an object and a sensor, and the lens includes a flat surface facing the object and an aspheric surface facing the sensor. The transparent plate is connected to the lens and disposed between the object and the lens. An abbe number of the lens is in a range from 30 to 50, an abbe number of the transparent plate is in a range from 40 to 60, and an effective focal length (EFL) of the imaging lens system is in a range from about 0.3 millimeters to about 0.4 millimeters.

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Tainan, Taiwan

Yin-Dong Lu