Average Co-Inventor Count = 1.87
ph-index = 24
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Headway Technologies, Incorporated (41 from 1,207 patents)
2. Magic Technologies, Inc. (33 from 118 patents)
3. Other (30 from 831,952 patents)
4. Western Digital (fremont), Inc. (12 from 728 patents)
5. Applied Spintronics, Inc. (9 from 31 patents)
6. Shanghai Ciyu Information Technologies Co., Ltd (3 from 4 patents)
7. Applied Spintronics Technology, Inc. (1 from 16 patents)
8. T3memory, Inc. (1 from 1 patent)
9. T3memory Usa, Inc., a California US Corporation (1 from 1 patent)
125 patents:
1. 11957063 - Magnetoresistive element having a nano-current-channel structure
2. 11910721 - Perpendicular MTJ element having a cube-textured reference layer and methods of making the same
3. 11854589 - STT-SOT hybrid magnetoresistive element and manufacture thereof
4. 11805702 - Methods of forming perpendicular magnetoresistive elements using sacrificial layers
5. 11600660 - Bottom-pinned magnetic random access memory having a composite SOT structure
6. 11569440 - Making a memoristic array with an implanted hard mask
7. 11545290 - Magnetoresistive element having a giant interfacial perpendicular magnetic anisotropy
8. 11527708 - Ultra-fast magnetic random access memory having a composite SOT-MTJ structure
9. 11450466 - Composite seed structure to improve PMA for perpendicular magnetic pinning
10. 11450467 - Magnetoresistive element having a giant interfacial perpendicular magnetic anisotropy and method of making the same
11. 11444239 - Magnetoresistive element having an adjacent-bias layer and a toggle writing scheme
12. 11316102 - Composite multi-stack seed layer to improve PMA for perpendicular magnetic pinning
13. 11271034 - Method of manufacturing magnetic memory devices
14. 11257862 - MRAM having spin hall effect writing and method of making the same
15. 11251367 - Composite multi-stack seed layer to improve PMA for perpendicular magnetic pinning