Shanghai Biren Technology Co., Ltd

YiKai Liang

Linglan Zhang

Kai Lei

WenQi Li

Jinfu Ye

Yudan Deng

Zheng Tian

DongCai Li

Huan Liu

Tingting Yu

Junhai Liu

A semiconductor die is provided. The semiconductor die includes a D2D transceiver composed of a single die or dual dies. The D2D transceiver includes a first D2D transmitter and a first D2D receiver. The D2D transmitter is configured to send data to a second D2D receiver in a second D2D transceiver of another semiconductor die using a first reference clock signal. The D2D receiver is configured to receive data from a second D2D transmitter in the second D2D transceiver using a second reference clock signal. Through using the embodiments of the disclosure, a transmission solution may be flexibly configured for a multi-application scenario including D2D.

Semiconductor die, electronic component, electronic apparatus and manufacturing method thereof

A chip and a chip test method are provided. The chip includes a receiver circuit and a test circuit. The receiver circuit includes a signal receiving unit and a signal bump. The signal bump is coupled to the signal receiving unit. The test circuit is coupled to a circuit node between the signal receiving unit and the signal bump. The test circuit includes a digital-to-analog converter, a first resistor, and a unit gain buffer. A first terminal of the first resistor is coupled to the circuit node. An output terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A first input terminal of the unit gain buffer is coupled to an output terminal of the digital-to-analog converter. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer.

Chip and chip test method

A chip and a chip testing method are provided. The chip includes a sending terminal circuit and a test circuit. The sending terminal circuit includes a signal sending unit and a first signal bump. The first signal bump is coupled to the signal sending unit. The test circuit is coupled to a circuit node between the signal sending unit and the first signal bump. The test circuit includes a first resistor, a unit gain buffer, and an analog-to-digital converter. A first terminal of the first resistor is coupled to the circuit node. A first input terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer. An input terminal of the analog-to-digital converter is coupled to the output terminal of the unit gain buffer.

Chip and chip testing method

The disclosure provides a clock step control circuit and a method thereof. The clock step control circuit includes a clock divider, a multiplexer, and a controller. The clock divider receives a first clock signal and outputs multiple second clock signals. The multiplexer receives the second clock signals and outputs one of the second clock signals. The controller is coupled to the clock divider and the multiplexer. When the controller receives an interrupt signal, the controller outputs a selection signal to the multiplexer according to the interrupt signal. The multiplexer outputs another one of the second clock signals according to the selection signal. The clock step control circuit and the method thereof in the disclosure can appropriately switch the clock signal to output a clock signal with an appropriate clock frequency.

Clock step control circuit and method thereof

Growing community of inventors

Shanghai, China

YiKai Liang