Applied Materials, Inc.

Yikai Chen

Jennifer Y Sun

Biraja Prasad Kanungo

Vahid Firouzdor

Yixing Lin

Chengtsin Lee

Siamak Salimian

Lin Zhang

Shuran Sheng

Yao-Hung Yang

David Fenwick

Aniruddha Pal

Ramesh Gopalan

Kevin A Papke

Joseph C Werner

Irena H Wysok

Hsin-wei Tseng

Halbert Chong

Stanley Wu

Ying Ma

Tasnuva Tabassum

Jiyong Huang

Saurabh M Chaudhari

Casey Jane Madsen

Mahesh Adinath Kanawade

Tianshu Li

A method for forming a part for a process chamber incorporates a substrate core in the part. The method may include performing a silicon carbide (SIC) deposition process on a substrate to form a SiC coating of approximately 1 mm to approximately 2 mm on all sides of the substrate to form a composite SiC structure where the substrate is composed of a stack of a plurality of substrates each with a thickness of approximately 1 mm to approximately 2 mm and separating the stack of the plurality of substrates of the composite SiC structure to form multiple composite structures where each multiple composite structure has an SiC coating on a top surface and on all side surfaces and a bottom surface of exposed substrate material.

Composite structures for semiconductor process chambers

Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.

Substrate support cover for high-temperature corrosive environment

An article includes a body having a plasma-sprayed ceramic coating on a surface thereof. The body can be formed of at one least one of the following materials: Al, AlO, AlN, YO, YSZ, or SiC. The plasma-sprayed ceramic coating can include at least one of YO, YAlO, YAlOor a solid-solution of YOmixed with at least one of ZrO, AlO, HfO, ErO, NdO, NbO, CeO, SmOor YbO. The plasma-sprayed ceramic coating can further include splats.

Plasma spray coating design using phase and stress control

An article comprises a body having a protective coating. The protective coating is a thin film that comprises a metal oxy-fluoride. The metal oxy-fluoride has an empirical formula of MOF, where M is a metal, y has a value of 0.1 to 1.9 times a value of x and z has a value of 0.1 to 3.9 times the value of x. The protective coating has a thickness of 1 to 30 microns and a porosity of less than 0.1%.

Protective metal oxy-fluoride coatings

Embodiments generally relate to a chamber component to be used in plasma processing chambers for semiconductor or display processing. In one embodiment, a chamber component includes a textured surface having a surface roughness ranging from about 150 microinches to about 450 microinches and a coating layer disposed on the textured surface. The coating layer may be a silicon layer having a purity ranging from about 90 weight percent to about 99 weight percent, a thickness ranging from about 50 microns to about 500 microns, and an electrical resistivity ranging from about 1 E-3 ohm*m to about 1 E3 ohm*m. The coating layer provides strong adhesion for materials deposited in the plasma processing chamber, which reduces the materials peeling from the chamber component. The coating layer also enables oxygen plasma cleaning for further reducing materials deposited on the chamber component and provides the protection of the textured surface located therebelow.

Coating for chamber particle reduction

Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.

Protective yttria coating for semiconductor equipment parts

Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.

Smart device fabrication via precision patterning

Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact.

Slurry plasma spray of plasma resistant ceramic coating

A ceramic coating is coated on a body of an article, wherein the ceramic coating includes YO, YAlO, YAlO, or a solid-solution of YOmixed with at least one of ZrO, AlO, HfO, ErO, NdO, NbO, CeO, SmOor YbO. The ceramic coating is applied to the body by a method including providing a plasma spraying system having a plasma current in the range of between about 100 A to about 1000 A, positioning a torch standoff of the plasma spraying system a distance from the body between about 60 mm and about 250 mm, flowing a first gas through the plasma spraying system at a rate of between about 30 L/min and about 400 L/min, and plasma spray coating the body to form a ceramic coating, wherein splats of the coating are amorphous and have a pancake shape.

A method for forming a plasma resistant ceramic coating on an article includes placing the article into a chamber or spray cell of a plasma spraying system. A ceramic powder is then fed into the plasma spraying system at a powder feed rate, and a plasma resistant ceramic coating is deposited onto at least one surface of the article in a plasma spray process by the plasma spray system. The plasma spray system is then used to perform an in-situ plasma flame heat treatment of the plasma resistant ceramic coating to form crust on the plasma resistant ceramic coating.

Plasma spray coating enhancement using plasma flame heat treatment

Disclosed herein are methods for fabricating layered ceramic materials via field assisted sintering technology. A method includes forming a ceramic green body on a surface of a substrate, and sintering the ceramic green body using a field-assisted sintering process to form a ceramic layer joined to the substrate.

Advanced layered bulk ceramics via field assisted sintering technology

To manufacture a coating for an article for a semiconductor processing chamber, the article including a body of at least one of Al, AlO, or SiC is provided and a ceramic coating is coated on the body, wherein the ceramic coating includes a compound of YO, AlO, and ZrO. The ceramic coating is applied to the body by a method including providing a plasma spraying system having a plasma current in the range of between about 100 A to about 1000 A, positioning a torch standoff of the plasma spraying system a distance from the body between about 60 mm and about 250 mm, flowing a first gas through the plasma spraying system at a rate of between about 30 L/min and about 400 L/min, and plasma spray coating the body to form a ceramic coating, wherein splats of the coating are amorphous and have a pancake shape.

A method includes immersing an article comprising a yttrium based oxide in an acidic cleaning solution comprising water and 1-10 mol % HF acid. A portion of the yttrium based oxide is dissolved by the HF acid. A yttrium based oxy-fluoride is formed based on a reaction between the HF acid and the dissolved portion of the yttrium based. The yttrium based oxy-fluoride is precipitated onto the article over the yttrium based oxide to form a yttrium based oxy-fluoride coating. The acidic cleaning solution may include a yttrium based salt, which may additionally react with the HF acid to form more of the yttrium based oxy-fluoride.

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Santa Clara, CA, United States of America

Yikai Chen