Gem Services, Inc.

Yiju Zhang

Hamza Yilmaz

Anthony Chia

LiMing Wang

Xiaoguang Zeng

Wong Hie Ming

Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment of a singulation process in accordance with the present invention, an initial, shallow saw cut into inter-package regions of the matrix exposes underlying metal to subsequent chemical etching steps. In an alternative embodiment, a separate photoresist mask may be patterned over the matrix to selectively expose metal in inter-package regions to chemical etching.

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Shanghai, China

Yiju Zhang