Samsung Electronics Co., Ltd.

Applied Materials, Inc.

Apple Inc.

Leland Stanford Junior University

Medtronic Minimed, Inc.

Yifei Wang

Ludovic Godet

Jinxin Fu

Junghyun Park

Mark Luitzen Brongersma

Zhenbin Ge

Yongan Xu

Peng Ning

Xiaoyang Zhang

Rutger Meyer Timmerman Thijssen

Yixiong Yang

Fei C Wang

Hyungryul J Choi

Xin Liu

Kurtis Leschkies

Wei V Tang

Akhil Srinivasan

Praveesh Chandran

Xianwei Zhao

Tingjun Xu

Francesco Aieta

Yuta Kuboyama

Chih-Wei Chuang

Yoshitaka Matsui

Bulent Kasman

Wenyi Liu

Pai Peng

Nicholas P Allec

Jun Xie

An Liu

Shyam Prasad

Ian Matthew McMackin

Chan Juan Xing

Ryan M Buck

Xiaoyong Fu

Wencong Zhu

Xi Chen

Zhujun Shi

Shigeto Kobori

Yukinori Asakawa

Rathinamoorthy Mylsamy

An electronic device may include a proximity sensor for detecting whether an external object is in the vicinity of the device. The proximity sensor may be implemented as an optical sensor module having a substrate, a light emitter die mounted on the substrate, a light detector die mounted on the substrate, and a package enclosure housing the light emitter and detector dies within the module. A infrared bandpass filter layer may be formed directly on the light detector die. The light detector die may have sidewalls at least partially covered by an opaque coating. The light detector die may include a highly doped backside reflection absorption layer interposed between an intrinsic absorption layer and an n-type layer within the light detector die. Opaque adhesive material may be used to mount the light detector die onto the surface of the substrate.

Optical sensor having opaque sidewall coating

An electronic device may have a display system. The display system may include a waveguide, an input coupler, and a surface relief grating (SRG) structure. There are various ways to form a SRG structure. In one example, nanoimprinting may be performed on a low-index resin to form a mold for a subsequent deposition of high-index material. The high-index material conforms to the mold to form ridges for the SRG structure. A reusable mold may be formed with a plurality of ridges on a flexible substrate and coated by an anti-stick coating. The reusable mold may be coated with a high-index material that is attached to a glass substrate and cured to form a wafer-level SRG structure with high-index ridges on a glass substrate. The wafer-level SRG structure is subsequently diced. SRG structures may also be formed that include varying trough thicknesses, varying ridge thicknesses, and/or a sloped substrate.

Methods of forming holographic gratings for optical systems

A wearable electronic device such as an earbud, wristwatch, or other device may be provided with a skin sensor. The skin sensor may use optical measurements to detect the presence of skin adjacent to the electronic device. The sensor may have first and second light-emitting devices such as infrared devices that emit light at respective first and second infrared light wavelengths. Reflected light is monitored by a photodetector. Control circuitry can initiate or pause audio playback or take other actions in response to determining from the reflected light measurements that skin is present. The sensor may have a thin-film interference filter or other optical structure that overlaps the first and second light-emitting devices to narrow the angular spread of light emitted from the skin sensor. This reduces tilt sensitivity and helps enhance skin sensor accuracy.

Electronic devices with skin sensors

Embodiments of the present disclosure include a die system and a method of comparing alignment vectors. The die system includes a plurality of dies arranged in a desired pattern. An alignment vector, such as a die vector, can be determined from edge features of the die. The alignment vectors can be compared to other dies or die patterns in the same system. A method of comparing dies and die patterns includes comparing die vectors and/or pattern vectors. The comparison between alignment vectors allows for fixing the die patterns for the next round of processing. The methods provided allow accurate comparisons between as-deposited edge features, such that accurate stitching of dies can be achieved.

Die system and method of comparing alignment vectors

Provided is a phase modulator including an antenna pattern, a lower reflective layer spaced apart from the antenna pattern in a vertical direction, a spacer provided between the antenna pattern and the lower reflective layer, and a phase shift pattern included in the spacer, the phase shift pattern including a phase shift material.

Phase modulator and phase modulator array including the same

Provided is an optical modulator including a substrate, and a plurality of meta units provided on the substrate and spaced apart from each other, wherein at least one of the plurality of meta units includes a metal layer provided on the substrate, a dielectric layer provided an upper surface and side surfaces of the metal layer, and an antenna provided on an upper surface of the dielectric layer, the antenna including phase change material, wherein a refractive index of the phase change material changes based on a voltage applied to the metal layer to modulate incident light.

Optical modulator and electronic apparatus including the same

A mobile communications device includes a near field communications (NFC) port and processor. The processor executes a trusted application within a trusted execution environment (TEE) for processing sensitive data. Additionally, the processor executes a NFC driver within the TEE for providing a secure channel between the trusted application and the NFC port such that sensitive data being exchanged across the secure channel are inaccessible to other processes being executed by the processor.

System and method for secure transactions with a trusted execution environment (TEE)

A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.

Methods for controlling physical vapor deposition metal film adhesion to substrates and surfaces

Embodiments of the present disclosure include measurement systems and grating pattern arrays. The measurement systems include multiple subsystems for creating diffraction patterns or magnified real images of grating regions on a substrate. The measurements systems are configured to reflect and transmit light, and the reflected and transmitted beams create diffraction patterns and enlarged images. The diffraction patterns and images provide information on grating pitch and angles of grating regions. Grating pattern arrays disposed on a substrate include main regions and reference regions. The reference regions are used to locate corresponding main regions. The measurement systems do not include a rotating stage, and thus precise control of rotation of a stage is not needed.

Measurement system and grating pattern array

Embodiments of the present disclosure relate to measurement systems and methods for diffracting light. The measurement system includes a stage, an optical arm, and one or more detector arms. The method of diffracting light includes a method of diffracting light is provided, including projecting light beams having wavelength &#x3bb;to a first zone of a first substrate at the fixed beam angle &#x3b8;and the maximum orientation angle &#x3d5;, obtaining a displacement angle &#x394;&#x3b8;, determining a target maximum beam angle &#x3b8;, wherein &#x3b8;=&#x3b8;+&#x394;&#x3b8;, and determining a test grating pitch Pby a modified grating pitch equation P=&#x3bb;/(sin &#x3b8;+sin &#x3b8;). The measurement system and method allow for measurement of nonuniform properties of regions of an optical device, such as grating pitches and grating orientations.

Measurement system and a method of diffracting light

The method of treating a film stack includes depositing a barrier film containing a metal into a via formed within a dielectric layer disposed on a substrate and depositing a metal contact on the barrier film within the via, where a void is located within the barrier film or between the barrier film and the metal contact. The method also includes exposing the metal contact and the barrier film to an oxidizing agent at a temperature of less than 400&#xb0; C. and at a pressure of about 20 bar to about 100 bar within a process chamber to produce a metal oxide within the void.

High pressure annealing of metal gate structures

A method is provided for wireless data transfer. The method includes determining, at a mobile device, communication capability of another device for receiving data. The method also includes selecting an optimal communication protocol for communicating the data based on the determined communication capability. The method also includes communicating the data with the other device using the selected optimal communication protocol.

Method and apparatus for intelligent communication selection

Growing community of inventors

Sunnyvale, CA, United States of America

Yifei Wang