International Business Machines Corporation

Motorola Corporation

Yifan Guo

Eric A Johnson

David James Alcoe

Steven Wayne Anderson

Natalie Barbara Feilchenfeld

Li Li

William T Chen

Jong-Kai Lin

Douglas H Strope

Scott E Lindsey

James Francis Chesko

Chunsheng Zhang

George Dean Ogden

Rao Bonda

Geoff Swan

Chun Kil Lim

Bongtae Han

A method of manufacturing components includes providing a substrate (,) having a first coefficient of thermal expansion (CTE), having a first surface (,), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (,) having a second CTE, having a second surface (,), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30&deg; C.

Method of manufacturing components and component thereof

Registration of the layers in a multilayer electronic device is tested and measured by X-ray moire interferometry.

Testing laminates with x-ray moire interferometry

A moire interferometer which is both portable and shielded from the environment, as well as a corresponding moire interferometric method, are disclosed.

Portable moire interferometer and corresponding moire interferometric

An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape 'wrinkling') associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

Electronic package with strain relief means and method of making

An attachment system (10,30) for electronic devices utilizes an interconnect substrate (11) and an attachment area (12,32) formed thereon. A non-wettable material (16,36) on a surface (13) of the substrate (11) substantially prevents an attachment material (17) from forming stress or cracks in the substrate (11).

Attachment system and method therefor

Electronic package with strain relief means

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Gilbert, AZ, United States of America

Yifan Guo