Cisco Technology, Inc.

Yida Zou

Zhiping Yang

Jie Xue

Sergio D Camerlo

Kenneth Hubbard

Luca Cafiero

Hsing-Sheng Liang

Gary L Myers

Bangalore J Shanker

David Anthony Popovich

Bobby Parizi

Robert Ballenger

An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.

Methods and apparatus for providing a power signal to an area array package

A circuit board component includes a substrate having non-conductive material and conductive material supported by the non-conductive material. The conductive material defines a circuit board interface, a die interface, a heat spreader interface, and (iv) a set of connections which interconnects the circuit board interface, the die interface and the heat spreader interface. The component further includes a die coupled to the die interface. The die includes integrated circuitry which is configured to electrically communicate with a circuit board when the circuit board couples to the circuit board interface. The component further includes a heat spreader coupled to the heat spreader interface. The heat spreader is configured to dissipate heat from the die. The heat spreader in combination with the heat spreader interface forms an electromagnetic interference shield when a portion of the circuit board interface connects to a ground reference of the circuit board.

Techniques for providing EMI shielding within a circuit board component

An electronic interconnection system for delivering high-current power and ground voltages using a non-bottom side of a chip package substrate. The system includes a printed wiring board (PWB), a chip package, and a bridge lead. The PWB has at least a first and a second contact pad. The chip package includes a chip and a package substrate. The chip is mounted onto the package substrate and the package substrate has a bottom surface having at least a first contact pad and a second surface having at least a second contact pad. The first contact pad of the PWB and the first contact pad of the package substrate are coupled together. The bridge lead couples the second contact pad of the PWB with the second contact pad of the package substrate. The bridge lead may be selected from styles including flying lead, edge wiping, top wiping, and double wiping.

Method and apparatus for delivering high-current power and ground voltages using top side of chip package substrate

A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the support plane. A heat pipe assembly, located within the defined space, has a relatively high thermal conductivity, compared to other thermally conductive materials, and transfers heat from the circuit board component to the support plane or carrier tray associated with the circuit board. The heat pipe assembly has an input portion that contacts the circuit board component and an output portion that contacts the support plane. The heat pipe assembly also has a compliant portion having a lower stiffness relative to the stiffness of either the input portion or the output portion. The compliant portion of the heat pipe assembly allows for displacement of the input portion relative to the output portion to limit the amount of stress generated by the heat pipe assembly on the circuit board component.

Methods and apparatus for cooling a circuit board component using a heat pipe assembly

A printed circuit board (PCB) has at least a first surface. A patterned electrically and thermally conductive layer is disposed on the first surface. A surface mount device (SMD) is disposed on an area of the layer and is attached thereto with solder. Heatsink elements, each including at least one flat surface, are placed by a pick and place assembly robot and permanently attached to the area with solder.

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San Jose, CA, United States of America

Yida Zou