Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Huazhong University of Science and Technology

Yicheng Chen

Hai Jin

Yu Zhang

Xiaofei Liao

Jin Zhao

Xiang Hui Zhao

Chi Hu

Beibei Si

Hong Wen

An anisotropic conductive adhesive, a display panel and a display device are provided. The anisotropic conductive adhesive includes an adhesive and a plurality of metal balls disposed in the adhesive. At least two annular grooves are defined by a surface of each of the metal balls.

Anisotropic conductive adhesive, display panel, and display device

The present invention provides a chip-on-film (COF) packaging structure and a COF packaging method. The COF packaging structure includes a flexible substrate and a chip. The flexible substrate includes a first groove provided on a first surface of the flexible substrate, a protrusion provided in the first groove, and a substrate bonding pad disposed in the first groove. The chip includes a second groove provided on a second surface of the chip, and a chip bonding pad disposed on the second surface and corresponding to the substrate bonding pad. The first groove of the flexible substrate is matched with a peripheral shape of the chip, and the second groove is matched with the protrusion of the first groove to embed the chip in the flexible substrate. The chip bonding pad is electrically connected to the substrate bonding pad.

Chip-on-film packaging structure and chip-on-film packaging method

The present disclosure relates to an FPGA-based dynamic graph processing method, comprising: where graph mirrors of a dynamic graph that have successive timestamps define an increment therebetween, a pre-processing module dividing the graph mirror having the latter timestamp into at least one path unit in a manner that incremental computing for any vertex only depends on a preorder vertex of that vertex; an FPGA processing module storing at least two said path units into an on-chip memory directly linked to threads in a manner that every thread unit is able to process the path unit independently; the thread unit determining an increment value between the successive timestamps of the preorder vertex while updating a state value of the preorder vertex, and transferring the increment value to a succeeding vertex adjacent to the preorder vertex in a transfer direction determined by the path unit, so as to update the state value of the succeeding vertex.

FPGA-based dynamic graph processing method

A flip-chip film includes a substrate and a plurality of flip-chip film units. The plurality of flip-chip film units are disposed on the substrate, and each of the flip-chip film units includes a plurality of first metal traces arranged at intervals. A punch cut is defined between the first metal traces of two adjacent flip-chip film units.

Growing community of inventors

Hubei, China

Yicheng Chen