Asml Netherlands B.v.

Apaq Technology Co., Ltd.

Yi-Ying Wang

Wei Fang

Chuan Li

Zhaohui Guo

Shih-Tsung Chen

Pang-Hsuan Huang

Shao-Wei Lai

Cho Huak Teh

Jian-Min Liao

Shih-Tsung Hsu

Ming-Tsung Chen

Ju Hao Chien

Robeter Jian

A server for knowledge recommendation for defect review. The server includes a processor electronically coupled to an electronic storage device storing a plurality of knowledge files related to wafer defects. The processor is configured to execute a set of instruction to cause the server to: receive a request for knowledge recommendation for inspecting an inspection image from a defect classification server; search for a knowledge file in the electronic storage device that matches the inspection image; and transmit the search result to the defect classification server.

Knowledge recommendation for defect review

A defect displaying method is provided in the disclosure. The method comprises acquiring defect group information from an image of a wafer, wherein the defect group information includes a set of correlations between a plurality of defects identified from the image and one or more corresponding assigned defect types and displaying at least some of the plurality of defects according to their corresponding assigned defect types.

Defect displaying method

The instant invention provides a capacitor package structure having a functional coating and the method for manufacturing the same. The method includes coating a silane coupling agent with a general formula of Y(CH)SiXon a capacitor element for forming the functional coating, in which X can be a same or different substituents and is selected from the group consisting of chloride, methoxy group, ethoxy group, methoxyethoxy group and acetoxy group, Y is a vinyl group, an amino group, an epoxy group, a methacryloyloxy group, a thiol group, a uramino group or an isobutyl group; and coating a conductive dispersion on the functional coating for enabling a polymer composite material in the functional coating to be connected to the surface of the capacitor element through the silane coupling agent.

Capacitor package structure with functional coating and method for manufacturing the same

A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance.

Solid electrolytic chip capacitor and manufacturing method thereof

Growing community of inventors

Hsinchu, Taiwan

Yi-Ying Wang