Texas Instruments Corporation

Yi Yan

Anindya Poddar

Luu Thanh Nguyen

Ashok S Prabhu

Hau Thanh Nguyen

Zhemin Zhang

Kenji Otake

Yuki Sato

Jeffrey Anthony Morroni

Genki Yano

Shoichi Iriguchi

Hiroyuki Sada

Takafumi Ando

Dok Won Lee

Mutsumi Masumoto

Woochan Kim

Vivek Kishorechand Arora

Makoto Shibuya

Kengo Aoya

Masamitsu Matsuura

Vijaylaxmi Gumaste Khanolkar

Hiep Xuan Nguyen

Daiki Komatsu

Hank Ming Sung

A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.

Semiconductor device package with internal magnetic shield for hall sensor

A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

Method for manufacturing an integrated transformer with printed core piece

An isolated power converter package includes a leadframe including a first and second die pad, first and second supports connected to first leads, second leads. A first semiconductor die is on the first die pad and a second semiconductor die is on the second die pad. The molded transformer includes a top and bottom side magnetic sheet each having a magnetic mold material including magnetic particles in a second dielectric material on respective sides of a laminate substrate including a dielectric material and a first coil and a second coil that each include a coil contact. Edges of the laminate substrate are on the supports. Bond wires are between the first die bond pads and the second leads, between the second die bond pads and the second leads, between the first die bond pads and coil contacts, and between the second die bond pads and the coil contacts.

Isolated power converter package with molded transformer

In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Method of manufacturing transformers with laminate windings and build-up films

Transformers with build-up films

An electronic device () includes a substrate () and an integrated circuit () provided on the substrate () having a surface facing away from the substrate (). An insulating layer () extends over the substrate () and around the integrated circuit () to define an interface () between the insulating layer () and the integrated circuit (). An electrically conductive via () is provided on the surface of the integrated circuit (). An insulating material () extends over the via () and includes an opening () exposing a portion of the via (). A repassivation member () extends over the insulating layer () and has a surface () aligned with the interface (). An electrically conductive redistribution member () is electrically connected to the via () and extends over the repassivation member () into contact with the insulating layer ().

Fan-out electronic device

In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.

Power module with enhanced heat dissipation

A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Integrated circuit backside metallization

Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.

Additive deposition low temperature curable magnetic interconnecting layer for power components integration

Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.

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Sunnyvale, CA, United States of America

Yi Yan