Pep Innovation Pte. Ltd.

Hydroemission Corporation, Pte Ltd

Yi Xin Chew

A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier () having a plurality of semiconductor chip receiving areas () and attaching a plurality of first semiconductor chips () to the semiconductor chip receiving areas (). The first semiconductor chips () are encapsulated with a first encapsulant () and a plurality of electrical connections () is formed to the first semiconductor chips (). At least a portion of the carrier () is removed to provide a heat release area ().

Semiconductor packaging method, semiconductor package and stacked semiconductor packages

A semiconductor processing method is provided. The method includes providing a first carrier (). A first adhesive () is provided on the first carrier () and a plurality of semiconductor chips () is placed on the first adhesive (). A second carrier () is provided. The second carrier () is provided with a plurality of chip receiving areas (). The first and second carriers () and () are then brought together to attach the semiconductor chips () to respective ones of the chip receiving areas () on the second carrier (). The first carrier () is then separated from the semiconductor chips ().

Semiconductor processing method

The present invention provides a device for delivering volatile substances, comprising: (i) a vapor permeable outer enclosure, said outer enclosure preferably being formed by a first laminate comprising a mesh material layer and a vapor permeable material layer laminated onto the mesh material layer; and (ii) a vapor impermeable inner enclosure placed inside the outer enclosure and defining an interior space for accommodating the volatile substances, said inner enclosure being formed by a second laminate comprising a metal foil layer and a rupturable material layer laminated onto the metal foil layer, wherein at least one die cut line to define a preformed hole is formed through the rupturable material layer. The invention also provides a method for delivering volatile substances.

Growing community of inventors

Singapore, Singapore

Yi Xin Chew