Intel Corporation

Yi Xia

Prabhakar Subrahmanyam

Ying-Feng Pang

Victor Polyanko

Rahima K Mohammed

Mark Bianco

Yuehong Fan

Jun Zhang

Ming Zhang

Pooya Tadayon

Damion T Searls

Jun Lu

David Shia

Richard J Dischler

Barrett M Faneuf

Casey R Winkel

Jin Yang

Eric W Buddrius

Bijoyraj Sahu

Kenan Huseyin Arik

Catharina Biber

Arun Krishnamoorthy

Michael Berktold

Kristin L Weldon

Tong Wa Chao

Ridvan A Sahan

Brendan T Pavelek

Carlos Alvizo Flores

Guoliang Ying

Liguang Du

Guangying Zhang

Yuyang Xia

Minh T D Le

Lianchang Du

Javier Avalos Garcia

Adriana Lopez Iniguez

Muhammad Ahmad

Luz Karine Sandoval Granados

Yuan Li

Yingqiong Bu

Shengzhen Zhang

Bergen Anderson

John Raatz

Jeffrey Ryan Conner

Samer Melhem

Xiang Que

Peng Wei

Chuanlou Wang

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

Technologies for isolated heat dissipating devices

An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.

Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips

An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

Optical leak detection of liquid cooling components within an electronic system

The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Thermal control for processor-based devices

Growing community of inventors

Campbell, CA, United States of America

Yi Xia