Advanced Semiconductor Engineering, Inc.

Yi Wen Chiang

Lu-Ming Lai

Hsun-Wei Chan

Hsin-Ying Ho

Kuang-Hsiung Chen

Shih-Chieh Tang

A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

Semiconductor device package and method for manufacturing the same

An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

Growing community of inventors

Kaohsiung, Taiwan

Yi Wen Chiang