Industrial Technology Research Institute

Yi-Tzu Peng

Wei-Cheng Tang

Yi-Che Su

Su-Mei Chen Wei

Ya-Tin Yu

Ya-I Hsu

Kai-Wei Liao

A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of Ris independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of Ris independently H or methyl, and each of Ris independently H or methyl.

Polymer and coating material

A resin composition formed by reacting a polyester-polyacid oligomer with a poly-epoxy oligomer is provided. The functionality of the resin composition is between 4 and 10. The weight average molecular weight of the resin composition is between 3,000 and 20,000 g/mol.

Resin composition and coating material using the same

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Yi-Tzu Peng