Commscope Technologies LLC

Commscope, Inc of North Carolina

Other

Lucent Technologies Inc.

Yi Teh Shih

Scott Martin Keith

Brian J Fitzpatrick

William Lonzo Woods, Jr

Thang Danh Truong

Raymond W Pilukaitis

William L Woods

Scott E Leonard

A telecommunications panel has various features for removably mounting patching devices to the panel. The telecommunications panel includes mounting flanges and ramp elements for facilitating mounting and removal of patching devices. The ramp element is associated with a receptacle opening of the panel and configured to contact a flexible latch of the patching device and depress the flexible latch as the patching device is received in the receptacle opening.

Telecommunications panel with patching device installation features

A telecommunications panel includes a panel frame and a ground wire secured to the panel frame. The ground wire extends longitudinally along the panel frame. The ground wire may be arranged such that modular jacks presses against the ground wire when the modular jacks are received in the panel frame. The ground wire can be made of a tin plated conductive material.

Telecommunications panel with grounding wire

Reduced-pair Ethernet patch cords include a twisted pair cable that has a pair of insulated conductors that are contained within a cable jacket. A connector is mounted on a first end of the cable. The connector includes a connector housing and a strain relief unit that is mounted on the cable at the interface between the cable and the connector housing. The strain relief unit includes a plurality of internal protrusions that contact the cable jacket.

Patch cords for reduced-pair Ethernet applications having strain relief units that resist rotational loads and related strain relief units and connectors

Patch cords for reduced-pair ethernet applications having strain relief units that resist rotational loads and related strain relief units and connectors

The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Lead-free solder process for printed wiring boards

A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.

Growing community of inventors

Richardson, TX, United States of America

Yi Teh Shih