Sipix Imaging, Inc.

Etansi Inc.

E Ink California, LLC

Yi-Shung Chaug

Rong-Chang Liang

Hongmei Zang

Xiaojia Wang

Jack Hou

Wanheng Wang

Gary Yih-Ming Kang

John Hanan Liu

Fei C Wang

Yajuan Chen

Jeanne E Haubrich

Robert Arthur Sprague

Jerry Chung

Zarng-Arh George Wu

Kangtai Ren

Jing-Den Chen

Sean Kiluk

Chia-Pu Chang

Scott Tseng

Hui W Chen

Fei Wang

Gary Kang

Gary Y M Kang

Ching-Shon Ho

Scott C J Tseng

Hong Mei Zang

Jimmy Yen

Jun Qi

Quan Gu

Feng Y Dai

Mike Sereda

Ryne M H Shen

The present invention relates to design and processes for the manufacture of backplane for segment displays. The process comprises: a) forming conductive lines on a non-conductive substrate layer; b) covering the conductive lines with a photoimageable material; c) forming conductive areas connected to the conductive lines and embedded in the photoimageable material; d) plating a conductive material over the photoimageable material to form segment electrodes; and e) optionally filling gaps between said segment electrodes with a thermal or radiation curable material followed by hardening said thermal or radiation curable material.

Manufacturing processes of backplane for segment displays

The invention is directed to compositions of display cell structure and electrode protecting layers for improving the performance of display devices. The composition comprises a polar oligomeric or polymeric material having a glass transition temperature below about 100&#xb0; C., and the resulting display cells or electrode protecting layer have an average crosslinking density of below about 1 crosslink point per 80 Dalton molecular weight.

Display cell structure and electrode protecting layer compositions

The present invention is directed to a flexible backplane for direct drive display devices and methods for its manufacture. The flexible backplane has many advantages. Because there is no need for a polyimide layer and only one layer of metal foil is used, the backplanes may be manufactured at a relatively low cost.

Flexible backplane and methods for its manufacture

The present invention relates to a process for manufacturing a brightness enhancement structure comprising micro-reflectors. The process comprises forming an array of micro-structures by embossing; and depositing a metal layer over the surface of the micro-structures. The present invention also relates to a process for manufacturing a display device comprising micro-reflectors. The present invention further relates to a display device comprising micro-reflectors and color filters.

Display devices having micro-reflectors and color filters

The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.

Thickness distribution control for electroplating

A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Process for forming a patterned thin film structure on a substrate

The present invention relates to methods for inspection of defects in an electrophoretic display and related devices. The method may be carried out with one or more testing electrodes. The method comprises applying a voltage difference to two testing electrodes which are in contact with the display panel, or applying a voltage difference to a testing electrode and a electrode layer. The methods may be applied in in-line or off-line inspection of a display panel.

Inspection methods for defects in electrophoretic display and related devices

A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Process for forming a patterned thin film structure for in-mold decoration

The present invention relates to the use of a scraping element for removing part of a display film coated or laminated to an electrode layer to expose the electrode layer for connection to a drive circuitry. The present invention is directed to a method for removing a portion of a display film coated or laminated on an electrode layer, a process for preparing a display device, and a process for preparing a passive matrix display device.

Post conversion methods for display devices

The present invention relates to a process for manufacturing a brightness enhancement structure comprising micro-reflectors. The process comprises forming an array of micro-structures by embossing; and depositing a metal layer over the surface of the micro-structures. The present invention also relates to a process for manufacturing a display device comprising micro-reflectors. The present invention further relates to a display device comprising micro-reflectors.

Display devices having micro-reflectors

The invention is directed to an embossing assembly comprising an embossing sleeve having a three-dimensional pattern formed thereon, an expandable insert; and a drum over which said sleeve and said expandable insert are mounted. The present invention is also directed to a method for preparing an embossing drum or an embossing sleeve. The present invention is further directed to a method for controlling the thickness of a plating material over the surface of a drum or sleeve in an electroplating process.

Embossing assembly and methods of preparation

The present invention provides methods and systems for testing and inspection of a display panel. The methods involve the application of voltages to rollers or testing conductive films. By applying a potential difference to the appropriate rollers or testing conductive films, different optical states of a display panel can be displayed for inspection.

Flexible display testing and inspection

This invention relates to an object having a display panel embedded in its top surface and processes for its manufacture. This invention also relates to an in-mold display transfer film or foil, which comprises a temporary carrier film, a release layer, a display panel, an adhesive or tie layer and optionally a durable layer.

In mold manufacture of an object with embedded display panel

The present invention relates to a backplane design for display panels and processes for their manufacture. The invention provides cost-effective ways to manufacture a display panel because the manufacture does not involve the use of a patterned ITO substrate, flexible printed circuit board or rigid circuit board. In addition, a roll-to-roll process can be employed to manufacture the display panel.

Growing community of inventors

Cupertino, CA, United States of America

Yi-Shung Chaug